M E M O R A N D U M November 3, 2016 TO: Members of the Board of Trustees FROM: Nancy L. Zimpher, Chancellor SUBJECT: Appointment of Dr. Bahgat G. Sammakia as Interim President of the State University of New York Polytechnic Institute Action Requested The proposed resolution appoints Dr. Bahgat G. Sammakia as Interim President of the State University of New York Polytechnic Institute. Resolution I recommend that the Board of Trustees adopt the following resolution: Resolved that the appointment of Dr. Bahgat G. Sammakia as Interim President of the State University of New York Polytechnic Institute, effective on or about December 1, 2016, be, and hereby is, approved. Dr. Sammakia will receive a salary of $425,000 per year from state funds. Dr. Sammakia will also receive a $5,000/month housing allowance and either use of a campus automobile or automobile allowance. This appointment will continue until the Board of Trustees, by resolution, appoints a successor, or the Board of Trustees or Chancellor takes further action with respect to the position of president. Background I recommend that Dr. Bahgat G. Sammakia be appointed Interim President of the State University of New York Polytechnic Institute (“SUNY Poly”). Dr. Sammakia is the Vice President for Research at the State University of New York at Binghamton, a position he has held since 2010. At Binghamton University since 1998, Dr. Sammakia has earned the rank of SUNY Distinguished Professor and holds a joint appointment in mechanical and materials engineering and systems science and industrial engineering. Board Resolution -2-November 3, 2016 As Vice President for Research, Dr. Sammakai is responsible for creating a research culture and infrastructure to enable growth of trans-disciplinary research and scholarly activity areas that are transformative and of a high and positive impact on society. He oversees state and federal government relations, research advancement, technology transfer and commercialization, and economic development and entrepreneurship. An internationally recognized scholar, Dr. Sammakia is the founding director of the Small Scale Systems Integration and Packaging Center, a NYS Center of Excellence. He was founding director of the NSF Industry/University Cooperative Research Centers (I/UCRC) on Energy Smart Electronic Systems, in collaboration with Binghamton University Professor Kanad Ghose. He was the co-founding director of the Center for Advanced Microelectronics Manufacturing in collaboration with Binghamton University Professor Mark Poliks and Cornell University. Prior to joining Binghamton University, Dr. Sammakia was employed by IBM Endicott from 1984 until 1998, and held various management positions, including managing the thermal and mechanical analysis groups, the surface science group, the chemical lab, the site technical assurance group and his last position as manager of development for organic packaging in the IBM Microelectronics Division. Dr. Sammakia has earned the high distinction of Fellow in the American Society of Mechanical Engineers (ASME); the Institute of Electrical and Electronics Engineers (IEEE); and the National Academy of Inventors (NAI). He is recipient of numerous honors and awards including the 2015 ASME Interpack Achievement Award for service, excellence, and international recognition in research/development related to electronic packaging. Dr. Sammakia holds 21 U.S. patents and 12 IBM technical disclosures; he has published over 250 technical papers in refereed journals and conference proceedings and has contributed to three books on natural convection heat transfer and electronics packaging. He is a member of the Industrial Advisory Board for the Cornell University NSF Center for Materials Research and Chair of the Board of the Southern Tier High Technology Incubator. He served as a member of the Board of Directors for the Research Foundation for SUNY from 2005 to 2013; was a founding member of the Board of Directors of the Southern Tier Opportunities Coalition from 2003 to 2010; and a member of the Board of Directors for Sheltered Workshop Solutions from 2000 to 2011. Dr. Sammakia earned his master’s degree and doctorate from the University at Buffalo. He holds a Bachelor of Science degree in mechanical engineering from Alexandria University in Alexandria, Egypt. A copy of Dr. Sammakia’s curriculum vitae is attached. Attachment 1-04-2016 Curriculum Vitae BAHGAT G. SAMMAKIA, PH.D. 1-04-201EDUCATION: • University of Pennsylvania, Philadelphia, PA Department of Mechanical Engineering and Applied Mechanics, Post-Doctoral Fellow 1981-1982 • University at Buffalo, SUNY, Buffalo, NY Doctor of Philosophy (Ph.D.) 1982 Dissertation: “Transient Natural and Mixed Convection Flows and Transport Adjacent to an Ice Surface Melting in Saline Water” • University at Buffalo, SUNY, Buffalo, NY Master of Science (M.S.) 1980 Thesis: “A Study of Transient Natural Convection in Air” • Alexandria University, Alexandria, Egypt Bachelor of Science (B.S.), Mechanical Engineering 1977 PROFESSIONAL EXPERIENCE IBM CORPORATION, Endicott, NY January 1984-August 1998 Senior Technical Staff Member/Project Manager Had the responsibility for all research and development for organic packaging in IBM IMD, Endicott, NY. The organization included six departments, with over 120 scientists, engineers and technicians and an annual budget totaling over 60 million dollars. The mission of the project was to research and develop all new organic products (chip carriers, cards and boards, connectors and new materials) for the IBM Microelectronics division. ACADEMIC EXPERIENCE Binghamton University, State University of New York, Binghamton, NY 1998-Present Present . Vice President for Research o Responsible for: • Creating a research culture and infrastructure to enable growth of trans-disciplinary research and scholarly activity areas that are transformative and of a high and positive impact on society • State and federal government relations • Research advancement • Technology transfer and commercialization • Economic development and entrepreneurship . Distinguished SUNY Professor of Mechanical and Materials Engineering, State University of New York at Binghamton, 2010 . Jointly appointed in the Systems Science and Industrial Engineering Department . Founding Director, Small Scale Systems Integration and Packaging Center (S3IP), a New York state Center of Excellence (COE) . Founding Director of the NSF IUCRC on Energy Smart Electronic Systems, (ES2) 2011 in collaboration with Professor Kanad Ghose in Computer Science. . Co-Founding Director of the Center for Advanced Microelectronics Manufacturing (CAMM) 2004 to 2010 in Collaboration with Professor Mark Poliks and Cornell University. . Fellow of the ASME and the IEEE societies . Fellow of the National Academy of Inventors since 2015 August 2003-July 2004 . Interim Vice President for Research, State University of New York at Binghamton September 1998-August 2003 . Professor of Mechanical Engineering, State University of New York at Binghamton Director of the Integrated Electronics Engineering Center (IEEC), A New York State Center of Advanced Technology Board Memberships: Member, Board of Directors, The Research Foundation of State University of New York, 2005 to 2013 Founding Member, Board of Directors Southern Tier Opportunities Coalition (STOC), 2003 to 2010. Member, Board of Directors, Sheltered Workshop Solutions (SWS), 2000 to 2011. Member, Industrial Advisory Board, Cornell University NSF Center for Materials Research (CCMR), 2007 to Present. Member of the SUNY senior research council since 2012. Chair of the board for the Southern Tier High Technology Incubator (STHTI) Awards and Honors: . Appointed as a Fellow of the National Academy of Inventors (2016) . Winner of the Interpack Achievement Award (2015) which is bestowed once every two years at the biannual ASME InterPACK Conference for demonstrated excellence and international recognition in the area of research and development related to electronic packaging, as well as service to the technical community at large. . Elevated to Institute of Electrical and Electronics Engineers (IEEE) Fellow in 2013 . 2012 Significant Contributor Award from Semi-Therm, For contributions furthering the development and validation of thermal simulation and methodologies, advancing the thermal analysis and control of electronic equipment and promoting an appreciation and understanding of the importance of thermal management in electronic systems and assemblies. . Promoted to Distinguished SUNY Professor in 2011. . Recognized by the ASME for services in advancing the engineering profession by serving as Program Chair for Interpack 2011. . 2010 Chancellor’s Award for Excellence in Scholarship and Creative Activities. . Member of Tau Beta Pi Engineering Honor Society. . 2010 ITherm (Intersociety (ASME and IEEE) Conference on Thermal and Thermomechanical Phenomena in Electronic Systems) Achievement Award, June 2010. This award is given once every two years to internationally recognized leaders in the area of thermal management in electronic systems. . Best Paper of the Year Award; M. Rayasam, S. Chaparala, D. Farnam, B. G. Sammakia, and G. Subbbarayan, “Thermal Solution Maps: A Strategy for Thermal Design of Three-Dimensional Packages,” Journal of Electronic Packaging, March 2009, Volume 131, Issue 1, 011015 (9 pages) DOI:10.1115/1.3077131. . FlexTech Alliance 2009 “Technology Leadership in Education” Awarded to Bahgat Sammakia, James Sturm (Princeton University), Christopher Ober (Cornell University) and Mark Poliks (Endicott Interconnect Technologies). . Outstanding Paper Award; Kanuparthi, S., Subbarayan, G., Sammakia, B., and Siegmund, T. “Microstructural Characteristics Influencing the Effective Thermal Conductivity of Particulate Thermal Interface Materials”, 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2008), Orlando, FL, May 28-31, 2008. . Outstanding Researcher Scholar; awarded by the Research Foundation of State University of New York, April 14th 2008. . Received the 2007 American Society of Mechanical Engineering Division award for the Electronics Packaging and Photonics Division (EPPD) for Excellence in the Area of Thermal Management of Electronic Systems. . “Best Paper Award”, EPPD Student Paper Session; Bhopte S., Sammakia B., and Murray B., “Mixing Enhancement of Two-Component Microchannel Flow: Geometric and Pulsed Flow Effects”, ASME IMECE 2007, Seattle, Washington. . Outstanding Lecturer, appointed by the IEEE CPMT Division as an outstanding lecturer, 2008. . Appointed as IEEE CPMT Society Board of Governors, member at large, 2006-07. . Received the ASME-K16 Committee on Heat Transfer of Electronics and the Electronic and Photonic Packaging Division Clock Award for Outstanding and Continuing Contributions to the Science and Engineering of Heat Transfer in Electronics, 2004. . State University of New York Partners in Excellence Award, recognized by the Chancellor for work founding the NY High Technology Commercialization Center in the area of Small Scale Systems Integration and Packaging, 2004. . State University of New York Chancellor’s Promising Inventor Award for novel approaches in thermal management-using nano-structured materials and the invention of thin bilayer coatings for electronics, 2003. . State University of New York Chancellor’s Award for Outstanding Contributions to Research, 2002. . Motorola award, “Silver Quill Award,” for joint publication of the Mechanical Engineering Handbook CRCnetBASE, 2001. . Received IBM stock options, 1997 and 1998 for outstanding management. . “IBM Blue Chip Award for Top Performers,” 1997. . Elected as an ASME Fellow, 1997. . Five IBM awards for publications excellence, 1987 to 1992. . Seven IBM awards for inventions filed, 1988 to 1996. . Four IBM awards for invention plateaus reached, 1988 to 1994. . Formal IBM division award for excellence in technical, people and business management, 1992. . Two IBM informal awards for excellence in technology development, 1996. . Post-Doctoral fellowship, University of Pennsylvania; funded by the Samuel Landis Gabel Endowment, 1982 to 1983. An Overview of Professor Sammakia’ s Research Activities: Establishment of the Energy Efficient Data Centers (NSF funded) This NSF IUCRC center is in its 5th year and Binghamton University is the lead institute. Professor Sammakia is the Founding Director. The focus of the research is on establishing data centers that are self-sensing and self-regulating and optimized to reduce energy consumption. http://www.binghamton.edu/es2/ Establishment of the New York State Center of Excellence in Small Scale Systems Integration and Packaging (S3IP): Professor Sammakia led a team of faculty and technical staff that worked on establishing a New York Center for High Technology Commercialization (2004) which was elevated to the status of New York State’s sixth Center of Excellence (S3IP) in 2007 with Professor Sammakia as its founding Director. The Center conducts research in electronics systems integration and packaging and has four major research thrusts: Electronics packaging, flexible Roll to Roll Electronics, Flexible thin film solar and energy efficient electronic systems. The center also has a campus wide advanced diagnostics laboratory (ADL) which serves faculty research as well as research collaborators from industry, other academic institutes and national labs. Professor Sammakia is the founding director of the Center of Advanced Microelectronics Manufacturing (CAMM) which was established in 2004 in collaboration with Cornell University and Endicott Interconnect Technologies. Professor Sammakia founded the NSF IUCRC in Energy Smart Electronic Systems in 2011, in collaboration with Professor Kanad Ghose from the Computer Science Department and faculty from the Georgia Institute of Technology, the University of Texas at Arlington, and Villanova. Professor Sammakia remains the NSF IUCRC PI and Center Director. Research Contracts and Grant Awards – over $42M in total sponsored funding for research activities since August 1998. Professor Sammakia’s current research covers several broad areas including Electronics Systems Integration and Packaging, flexible electronics, thermal management of electronic devices and systems, optimization of three dimensional electronics packaging, micro scale mixing, and biomedical applications incorporating flexible electronic systems. His primary funding sources have been the National Science Foundation(NSF), the National Institute of Standards and Technology (NIST) through the Advanced Technology Program (ATP), the National Aeronautical and Space Administration (NASA), the Army Research Laboratories (ARL), The Department of Defense (DOD), the Semiconductor Research Corporation (SRC), The Defense Threat Reduction Agency (DTRA), the office of Naval Research (ONR),the New York State Energy Research and Development Authority (NYSERDA), the New York State Foundation for Science Technology and Innovation (NYSTAR), Empire State Development (ESD), and industry. GRANTS AND CONTRACTS Research Awards for 2015 to 2016 Total of $3.65 M Research Awards for 2014 to 2015 Total of $3.7 M Research Awards for 2013 to 2014 Total of $1.98 M Research Awards & Projects, 2013 to 2012 . Lumen Dynamics Group Inc: IEEC Lumen Dynamics 12083738, 01-Jan-2012 to 31­Dec-2012, P-1101489, A-60594, (PI) $3,000. . Rambus Inc: I/URC Membership for Energy Efficient Electronic Systems, 01-Jan-2012 to 31-Dec-2013, P-1100564, A-60147, (Co-PI) $50,000. . NYS Department of Economic Development: COE 12/13 S3IP, 01-APR-2012 to 31­MAR-2013, P-1102161, A-60899, (PI) $872,333.00. . Smart Modular Technology: IEEC Membership, 01-APR-2012 to 31-MAR-2013, P­1102082, A-60869, (PI) $3,000. . Empire State Development Corp: New York Center for Advanced Interconnect Science & Technology, 01-MAY-2012 to 31-MAY-2014, P1110594, 1112860, A-61007, (Co-PI) $35,002. . BAE Systems Controls Inc: Failure Analysis and Reliability Assessment, 01-MAY­2012 to 31-MAY-2013, P-1102377, A-60994, (PI) $15,000. . Purdue University: 3-D Simulations of Electromigration Driven Failure: Enabling Limiting Current Prediction for Cu Pillar Microbumps and 3D TSVs, 01-MAY-2012 to 31-MAY-2014, P-1102377, A-61269, (PI) $20,000. . Analog Devices: Support of an IEEC Graduate Student dedicated to ADL projects, 01-JUN-2012 To 31-MAY-2013, P-1103975, A-61653, (PI) $40,000. . Prismark Partners LLS: Tear Down Project 2012-2013, 01-SEP-2012 to 31-AUG­2013, P-1104963, A-62064 (PI) $20,000. . Corning Inc: CAMM Membership – Corning, 01-SEP-2012 to 31-AUG-2013, P-1110361, A-64611, (PI) $30,000. . Corning Inc: IEEC Membership – Corning, 01-OCT-2012 to 30-SEP-2013, P-1107145, A-63137, (PI) $60,000. . Johnson Outdoors Inc: Thermal Analysis for Tent Liner System, 01-JAN-2013 to 30­AUG-2013, P-1111626, A-65179 (PI) $15,000. . NYS Department of Economic Development: Center of Excellence 2013-2014, 01­APR-2013 to 30-SEP-2013, P-1109414, 1109415, 1109417, 1109418, A-64154, (PI) $461,645. Research Awards & Projects, 2012 to 2011 . NYS Department of Economic Development: Center for Advanced Technology 7/1/11­6/30/14, 01-Jul-2012 to 31-Dec-2012, P-1103854, A-58387 (PI) $400,000.00. . Analog Devices: Support of an IEEC Graduate Student dedicated to ADL projects, 01­Jun-2012 to 31-May-2013, P-1103975, A-61653 (PI) $40,000.00. . Purdue University: 3-D Simulations of Electromigration Driven Failure: Enabling Limiting Current Prediction for Cu Pillar Microbumps and 3D TSVs, 01-May-2012 to 30-Apr-2013, P-1102959, A-61269 (PI) $10,000.00. . BAE Systems Controls Incorporated: Failure Analysis and Reliability Assessment, 01­May-2012 to 31-May-2013, P-1102377, A-60994, (PI) $15,000.00. . Smart Modular Technologies Inc: IEEC Membership -Smart Modular Technologies, 01-Apr-2012 to 31-Mar-2013, P-1102082, A-60869, (PI) $3,000.00. . NYS Department of Economic Development: Center of Excellence 2012-2013, 01­Apr-2012 to 30-Sep-2012, P-1102161, A-60899, (PI) $104,061.00. . NYS Department of Economic Development: Center of Excellence 2012-2013, 01­Apr-2012 to 30-Sep-2012, P-1102216, A-60899, (PI) $286,367.00. . NYS Department of Economic Development: Center of Excellence 2012-2013, 01­Apr-2012 to 30-Sep-2012, P-1102219, A-60899, (PI) $36,726.00. . NYS Department of Economic Development: Center of Excellence 2012-2013, 01­Apr-2012 to 30-Sep-2012, P-1102221, A-60899, (PI) $8,846.00. . National Transportation Safety Board: Solid-State Electronic Devices Chip Level Examination and Data Recovery Services, 08-Jan-2012 to 08-Feb-2012, P-1101061, A-58651, (PI) $1,391.74. . Lumen Dynamics Group Incorporated: IEEC Membership -Lumen Dynamics Group,INC, 01-Jan-2012 to 31-Dec-2012, P-1101489, A-60594, (PI) $3,000.00. . Rambus Incorporated: I/URC Membership for Energy Efficient Electronic Systems 01­Jan-2012 to 31-Dec-2012, P-1100564, A-60147, (PI) $25,000.00. . Cookson Electronics: IEEC Membership -Cookson Electronics, 15-Nov-2011 to 14­Nov-2012, P-1101100, A-60391, (PI) $3,000.00. . Cornell University: Flexible Electronics for Biological & Life Science Applications (Flex E Bio) Graduate Education & Research Traineeship Program (IGERT) DGE­0654112, 1-Sep-11 to 31-Aug-12, P-1099550, A-45341, (PI) $60,178.34. . Cornell University: Flexible Electronics for Biological & Life Science Applications (Flex E Bio) Graduate Education & Research Traineeship Program (IGERT) DGE­0654112, 01-Sep-2011 to 31-Aug-2012, P-1099551, A-45341, (PI) $59,230.51. . Microsoft Corporation: Microsoft's Membership in the I/UCRC for Energy-Efficient Electronic Systems, 01-Sep-2011 to 31-Aug-2012, P-1098920, A-59335, (PI) $50,000.00. . National Transportation Safety Board: Solid-State Electronic Devices Chip Level Examination and Data Recovery Services, 01-Sep-2011 to 30-Sep-2011, P-1099392, A-58651, (PI) $1,026.66. . National Transportation Safety Board: Solid-State Electronic Devices Chip Level Examination and Data Recovery Services, 01-Sep-2011 to 30-Sep-2011, P-1099393, A-58651, (PI) $825.92. . Endicott Research Group Incorporated: ERG's Participating Membership in IEEC, 01-Sep-2011 to 31-Aug-2012, P-1099820, A-59742, (PI) $3,012.16. . NYS Energy Research and Development Authority: I/UCRC Membership 2011/2012 for Energy-Efficient Electronic Systems, 01-Sep-2011 to 31-Aug-2012, P-1102317, A-60962, (PI) $50,000.00. . Endicott Interconnects Technologies Inc: 2011/2012 I/UCRC Membership for Energy-Efficient Electronic Systems, 01-Sep-2011 to 31-Aug-2012, P-1099955, A-59808 (PI) $50,000.00. . Corning Incorporated: CAMM Membership – Corning, 01-Sep-2011 to 31-Aug-2012 P-1097733, A-58773, (PI) $31,732.59. . National Science Foundation: Collaborative Center: I/UCRC in Energy-Efficient Electronic Systems, 15-Aug-2011 to 31-Jul-2013, P-1097700, A-58755, (PI) $590,000.00. . National Transportation Safety Board: Solid-State Electronic Devices Chip Level Examination and Data Recovery Services, 21-Jul-2011 to 05-Aug-2011, P-1097473, A-58651, (PI) $2,315.28. . Imperial Machine and Tool Company: Energy Efficient Miniaturization with Anti-Tampering Technology for ARDEC MS Hybrid Products, 01-Jul-2011 to 30-Jan-2013 P-1096540, A-58236, (PI) $600,000.00. . Siliconware Precision Industries Company LTD: IEEC Membership -Siliconware Precision Industries, 01-Jul-2011 to 30-Jun-2012, P-1098275, A-59055, (PI) $29,982.00. . NYS Department of Economic Development: Center for Advanced Technology 7/1/11­6/30/14, 01-Jul-2011 to 30-Jun-2012, P-1096898, A-58387, (PI) $921,200.00. . US Navy Office of Naval Research: Thin Film Photovoltaic Cells on Flexible Substrates Integrated with Energy Storage, 01-Jun-2011 to 13-Aug-2013, P-1097403, A-58562, (Co-PI) $183,600.00. . US Navy Office of Naval Research: Thin Film Photovoltaic Cells on Flexible Substrates Integrated with Energy Storage, 01-Jun-2011 to 31-Aug-2013, P-1097285, A-58562, (Co-PI) $380,242.00. . US Navy Office of Naval Research: Thin Film Photovoltaic Cells on Flexible Substrates Integrated with Energy Storage, 01-Jun-2011 to 31-Aug-2013, P-1097402, A-58562, (Co-PI) $183,600.00. . Panduit Corporation: Panduit's Support of the NSF Collaborative Center I/UCRC in Energy-Efficient Systems, 01-Jun-2011 to 31-Aug-2012, P-1095350, A-57724, (PI) $100,000.00. . Analog Devices: Support of a Graduate Student Dedicated to ADI Projects, 01-Jun­2011to 31-May-2012, P-1097418, A-58627, (PI) $40,000.00. . Bloomberg LP: Bloomberg's Support of the NSF Collaborative Center I/UCRC in Energy-Efficient Systems, 01-May-2011 to 31-Aug-2012, P-1095349, A-57723, (PI) $50,000.00. . Semiconductor Research Corporation: The New York Center for Advance Interconnect Science and Technology (CAIST), 01-Apr-2011 to 30-Apr-2013, P-1095056, A-35852, (Co-PI) $182,600.00. . Purdue University: Electrical-Mechanical Design Optimization for Through-Silicon Vias, 01-Apr-2011 to 30-Apr-2013, P-1097032, A-58454, (PI) $29,200.00. . Advanced Micro Devices Inc: IEEC Membership 2011/2012, 01-Apr-2011 to 31-Mar­2013, P-1094148, A-57203, (PI) $60,000.00. . Endicott Interconnects Technologies Inc: IEEC Membership 2011/2012, 01-Apr­2011to 31-Mar-2013, P-1099953, A-59803, (PI) $60,000.00. . Norwich Aero Products Incorporated: IEEC Membership-Norwich Aero Product, 01­Apr-2011 to 31-Mar-2013, P-1094810, A-57501, (PI) $6,000.00. . Xerox Corporation: CAMM Membership –Xerox, 01-Apr-2011 to 31-Mar-2012, P­1094400, A-57301, (PI) $40,173.89. . Samsung Electronics Co LTD: IEEC Membership Samsung, 01-Mar-2011 to 29-Feb­2012, P-1093994, A-57130, (PI) $50,000.00. . Ephesus Technologies LLC: Graphene Project, 01-Mar-2011 to 29-Feb-2012, P-1094127, A-57190 (PI) $33,300.00. . Analog Devices: IEEC Membership 2011-2012 Analog Devices, 08-Feb-2011 to 07-Feb­2013, P-1094821, A-57506, (PI) $120,068.12. . EnerG2 Incorporated: IEEC Participating Membership, 01-Feb-2011 to 20-Apr-2012, P-1093756, A-57019, (PI) $3,000.00. . Lockheed Martin: IEEC 2011/12 Membership Lockheed Martin, 01-Jan-2011 to 31­Dec-2012, P-1095594, A-57843, (PI) $120,001.62. . NYS Department of Economic Development: NYSTAR COE 2011, 01-Jan-2011 to 31­Mar-2012, P-1093282, A-56794, (PI) $433,630.04. . NYS Department of Economic Development: NYSTAR COE 2011, 01-Jan-2011 to 31­Mar-2012, P-1093283, A-56794, (PI) $1,113,607.00. . NYS Department of Economic Development: NYSTAR COE 2011, 01-Jan-2011 to 31­Mar-2012, P-1093284, A-56794, $197,426.96, (PI) Research Awards & Projects, 2010-2009 . General Electric Company: Thermal Modeling on Concentrated PV with Hot Water Design Concept, 18-Oct-2010 to 31-Dec-2010, P-1093010, A-56655, (PI) $2,992.30. . Cornell University: Flexible Electronics for Biological & Life Science Applications (Flex E Bio) Graduate Education & Research Traineeship Program (IGERT) DGE­0654112, 01-Sep-2010 to 31-Aug-2012, P-1093290, A-45341, (PI) $47,264.77. . Endicott Research Group Incorporated: IEEC Membership Endicott Research Group, 01-Sep-2010 to 31-Aug-2011, P-1090844, A-55543, (PI) $2,987.84. . Advanced Semiconductor Engineering Incorporated: IEEC Membership for Advanced Semiconductor Engineering, 01-Sep-2010 to 31-Aug-2012, P-1090843, A-55542, (PI) $120,000.00. . Corning Incorporated: CAMM Membership 2010/2011 Agreement 11030689, 01-Sep­2010 to 31-Aug-2011, P-1090875, A-55558, (PI) $28,287.56. . National Science Foundation: I/UCRC Planning Grant: I/UCRC for Energy Efficient Systems, 01-Aug-2010 to 31-Jul-2011, P-1089619, A-54987, (PI) $13,000.00. . Johnson Outdoors Incorporated: Thermal Analysis Studies, 15-Jul-2010 to 31-Jul­2011, P-1089587, A-54975, (PI) $15,000.00. . NYS Department of Economic Development, NYSTAR CAT Funding, 01-Jul-2010 to 30-Jun-2011, P-1088941, A-43249, (PI) $921,200.00. . Multiple Sponsors: Electronics Packaging Symposium, 01-Jun-2010 to 31-Dec-2011, P-1088229, A-54401, (PI) $13,667.23. . Multiple Sponsors: Flexible Electronics Symposium 2010, 01-Jun-2010 to 30-Jun-2011, P-1088228, A-54398, (PI) $12,229.73. . Analog Devices: ADI's Support of a Graduate Student for 2010/2011, 01-Jun-2010 to 31­May-2011, P-1088592, A-54555, (PI) $40,000.00. . Advanced Micro Devices Inc: IEEC Membership -Advanced Micro Devices 2010/2011, 01-Apr-2010 to 31-Mar-2011, P-1086722, A-53856, (PI) $32,000.00. . Smart Modular Technologies Inc: IEEC Membership -Smart Modular Technologies, 01-Apr-2010 to 31-Mar-2011, P-1088398, A-54453, (PI) $3,199.86. . Endicott Interconnects Technologies Inc: IEEC Membership 10/11, 01-Apr-2010 to 31-Mar-2011, P-1090969, A-55601, (PI) $62,121.92. . Ioxus Incorporated: IEEC Membership-Ioxus, 15-Mar-2010 to 14-Mar-2012, P-1086217, A-53639, (PI) $6,000.00. . Analog Devices: CAMM Membership-Analog, 01-Feb-2010 to 31-Jan-2011, P-1087160, A-53984, (PI) $20,000.00. . Defense Advanced Research Projects Agency (DARPA): Center for Autonomous Solar Power (CASP), 13-Jan-2010 to 30-Jun-2012, P-1085273, A-53137, (Co-PI) $750,000.00 . Lockheed Martin Systems Integration Company: IEEC Membership Lockheed Martin, 01-Jan-2010 to 31-Dec-2010, P-1087426, A-54060, (PI) $59,998.38. . Faradox Energy Storage Incorporated: Phase II Support for DOE SBIR "High Temperature, High Energy Density Film Capacitors", 01-Jan-2010 to 30-Jun-2011, P-1086181, A-53610, (PI) $45,080.00. . Empire State Development Corp: New York State Center of Excellence in Systems Integration and Packaging 2010, 01-Jan-2010 to 31-Dec-2010, P-1084677, A-52846, (PI) $804,166.00. . NASA John H Glenn Research Center at Lewis Field: FY09 Earmark-To develop a focused research and development initiative on large area flexible solar cell modules. 01­Jan-2010 to 30-Jun-2011, P-1083999, A-52509, (Co-PI) $500,000.00. . NanoMas Technologies Incorporated: IEEC Membership-Nanomas, 01-Dec-2009 to 30-Nov-2011, P-1086216, A-53628, (PI) $6,000.00. . Xerox Corporation: Research in Superoleophobic Surfaces for Use in Printing Technologies, CAMM Membership, 01-Dec-2009 to 31-Jan-2010, P-1084744, A-52879, (PI) $959.00. . Xerox Corporation: Research in Superoleophobic Surfaces for Use in Printing Technologies, CAMM Membership, 01-Dec-2009 to 31-Mar-2011, P-1084742, A-52879, (PI) $19,826.11. . Xerox Corporation: Research in Superoleophobic Surfaces for Use in Printing Technologies, CAMM Membership, 01-Dec-2009 to 31-Dec-2011, P-1084743, A-52879, $79,041.00. . Corning Incorporated: IEEC Membership Corning Inc., 01-Oct-2009 to 30-Sep-2012 P-1083640, A-52357, (PI) $180,000.00. . US Department of Energy: Development and Pilot Manufacture of Pseudo-Electric Double Layer Capacitors, 29-Sep-2009 to 28-Sep-2010, P-1083210, A-52152, (PI) $1,386,410.26. . US Department of Energy: Development and Pilot Manufacture of Pseudo-Electric Double Layer Capacitors, 29-Sep-2009 to 31-Dec-2009, P-1083212, A-52152, (PI) $876.74. . Corning Incorporated: CAMM Membership -Corning Inc., 01-Sep-2009 to 31-Aug­2010, P-1083418, A-52259, (PI) $29,979.85. . Endicott Interconnects Technologies Inc: CAMM Membership-Endicott Interconnect Technology 2009/2010, 01-Sep-2009 to 31-Aug-2010, P-1082929, A-52011, (PI) $30,000.00. . NYS Department of Economic Development: NYSTAR CAT Funding, 01-Jul-2009 to 30-Jun-2010, P-1080577, A-43249, (PI) $921,200.00. . UniPixel Displays Incorporated: CAMM Full Membership Uni-Pixel Displays, 01-Jul­2009 to 30-Jun-2010, P-1081309, A-51203, (PI) $20,000.00. . Analog Devices: ADI's Support of a Graduate Student Dedicated to ADI Projects, 01­Jun-2009 to 31-May-2010, P-1080185, A-50659, (PI) $53,822.66. . Smart Modular Technologies Inc, IEEC Membership-Smart Modular Technologies, 01­Apr-2009 to 31-Mar-2010, P-1078890, A-50157, (PI) $2,800.14. . Amphenol Aerospace Operations: 2009-2011 IEEC Membership Amphenol Aerospace, 01-Apr-2009 to 31-Mar-2013, P-1080354, A-50737, (PI) $14,000.00. . Analog Devices: IEEC Membership: Analog Devices, 08-Feb-2009 to 07-Feb-2011, P-1080184, A-50658(PI) $119,931.88. . Purdue University: The Impact of Chip-Package Interactions: Models and Experiments for Reliable Design of CU/Low-k Packages, 01-Feb-2009 to 31-Mar-2012, P-1081608, A-51334, (PI) $150,000.00. . Empire State Development Corp: New York Center of Excellence in Small Scale Systems Integration and Packaging, 01-Jan-2009 to 31-Dec-2009, P-1076851, A-49194, (PI) $95,616.00. . BAE Systems Controls Incorporated: IEEC Membership – BAE, 01-Jan-2009 to 31­Dec-2012, P-1076545, A-49097, (PI) $240,000.00. . Sanmina-SCI Corporation: Sanmina's Support of the IEEC, 01-Jan-2009 to 31-Dec­2009, P-1079272, A-50292, (PI) $1,500.00. . Empire State Development Corp: New York Center of Excellence in Small Scale Systems Integration and Packaging, 01-Jan-2009 to 01-Jan-2010, P-1076733, A-49194, (PI) $1,052,690.00. . Lockheed Martin Corporation: 2009 IEEC Membership Lockheed Martin, 01-Jan-2009 to 08-Jan-2010, P-1079176, A-50238, (PI) $60,000.00. Research Awards & Projects, 2008-2007 . NanoMas Technologies Incorporated: Membership in IEEC, 01-Dec-2008 to 30-Nov­2009, P-1075788, A-48678, (PI) $3,000.00. . Analog Devices: CAMM Membership -Analog Devices Inc., 01-Nov-2008 to 31-Jan­2010, P-1076914, A-49286, (PI), $10,000.00. . Sematech: Strategic Alliance Agreement, 01-Oct-2008 to 31-Dec-2010, P-1077278 A­46560, (Co-PI) $21,600.00. . Prismark Partners LLC: Teardown Project for Prismark Partners, 01-Sep-2008 to 31­Aug-2012, P-1076511, A-49075, (PI) $80,000.00. . Corning Incorporated: CAMM Membership Corning Inc., 01-Sep-2008 to 31-Aug­2009, P-1075550, A-48581, (PI) $30,000.00. . Imperial Machine and Tool Company: Glider Design Studies, 01-Aug-2008 to 31-Jul­2009, P-1073786, A-47730, (PI) $19,561.82. . Antares Advanced Test Technologies: IEEC Membership: Antares Advanced Test Technologies, 01-Jul-2008 to 30-Jun-2009, P-1072913, A-47329, (PI) $10,500.00. . NYS Department of Economic Development: NYSTAR CAT Funding, 01-Jul-2008 to 30-Jun-2009, P-1072352, A-43249, (PI) $921,200.00. . Analog Devices, Support of a Graduate Student Dedicated to ADI Projects, 01-Jun-2008 to 31-May-2009, P-1072912, A-47326, (PI) $24,177.34. . New Visual Media Group, LLC: Energy Efficient Billboard Displays, 15-May-2008 to 14-Jul-2009, P-1071264, A-46604, (PI) $25,000.00. . Amphenol Aerospace Operations: IEEC Participating Membership: Amphenol Aerospace Corporation, 01-Apr-2008 to 31-Mar-2009, P-1069630, A-46085, (PI) $3,500.00. . Endicott Interconnects Technologies Inc: IEEC Membership: Endicott Interconnect Technologies, 01-Apr-2008 to 31-May-2010, P-1073051, A-47365, (PI) $117,878.08. . Endicott Research Group Incorporated: IEEC Endicott Research Group Participating Membership 2008-2009, 19-Mar-2008 to 18-Mar-2009, P-1070379, A-46338 (PI) $3,000.00. . Samsung Electronics Co LTD: IEEC Membership: Samsung, 15-Feb-2008 to 15-Nov­2008, P-1069579, A-46062, (PI) $10,000.00. . Analog Devices: IEEC Membership: Analog Devices, 08-Feb-2008 to 07-Feb-2009, P-1071380, A-46655 (PI) $60,000.00. . General Electric Company: IEEC Membership: General Electric Company, 01-Feb­2008 to 31-Aug-2009, P-1076845, A-49248 (PI) $60,000.00. . Lockheed Martin Corporation: IEEC Membership: Lockheed Martin, 01-Jan-2008 to 02-Jan-2009, P-1073700, A-47690, (PI) $60,000.00. . IBM Corporation: IEEC Membership 2008-2012, 01-Jan-2008 to 31-Dec-2012 P-1069558, A-46051, (PI) $300,000.00. . Silk Displays: CAMM Membership: Silk Displays, 01-Jan-2008 to 31-Aug-2009, P-1068605, A-45611, (PI) $12,985.00. . Rohm & Haas Electronic Materials LLC: CAMM Participating Membership: Rohm & Haas, 01-Dec-2007 to 30-Nov-2010, P-1068522, A-45571 (PI) $60,000.00. . Multiple Sponsors: Center of Excellence Equipment Support, 01-Nov-2007 to 31-Oct­2010, P-1067609, A-45100, (PI) $8,000.00. . STATS ChipPAC Ltd's: IEEC Membership: STATS ChipPAC 07/08, 01-Nov-2007 to 31-Oct-2008, P-1068508, A-45575, (PI) $39,985.00. . NASA Goddard Space Flight Center: Advanced Microelectronics Manufacturing: Roll-to-Roll Manufacturing of Microelectronics on Flexible Substrates, 01-Nov-2007 to 31­Oct-2009, P-1067174, A-44893 (PI) $919,692.00. . Corning Incorporated: IEEC Membership: Corning Incorporated, 01-Oct-2007 to 30­Sep-2009, P-1068308, A-45463, (PI) $120,000.00. . US Army Research Development & Engineering Command: The Center for Advanced Microelectronics Manufacturing, 12-Sep-2007 to 31-Aug-2012, P-1066475, A-44575, (PI) $3,102,740.00. . Cornell University: Flexible Electronics for Biological & Life Science Applications (Flex E Bio) Graduate Education & Research Traineeship Program (IGERT) DGE­0654112, 01-Sep-2007 to 31-Oct-2010, P-1068054, A-45341, (PI) $275,185.85. . Texas Instruments: IEEC Membership: Texas Instruments, 01-Sep-2007 to 31-Aug­2008, P-1068736, A-45670, (PI) $60,000.00. . Georgia Institute of Technology: IEEC Membership -Dr. Rao Tummalo at Georgia Tech, 01-Sep-2007 to 31-Aug-2009, P-1075804, A-48687, $43,000.00. . Prismark Partners LLC, Tear Down Project for Prismark Partners LLC, 01-Sep-2007 to 31-Aug-2008, P-1068916, A-45766, (PI) $20,000.00. . Endicott Interconnects Technologies Inc, CAMM Membership: EIT, 01-Sep-2007 to 31-Aug-2009, P-1066559, A-44613, $50,000.00. . Texas Instruments: CAMM Membership: Texas Instruments, 01-Sep-2007 to 31-Aug­2009, P-1067020, A-44815, (PI) $30,000.00. . Samsung Electronics Co LTD, CAMM Membership-Samsung Electronics, 31-Aug­2007 to 31-Aug-2009, P-1065963, A-44326, (PI) $99,982.00. . Corning Incorporated: Green Laser Optoelectronic Packages for Consumer Applications, 01-Jul-2007 to 31-Mar-2009, P-1064697, A-43740, (PI) $85,000.00. . Samsung Electronics Co LTD: IEEC Membership: Samsung, 01-Jul-2007 to 15-Dec­2007, P-1065045, A-43885, (PI) $20,000.00. . NYS Department of Economic Development: NYSTAR CAT Funding, 01-Jul-2007 to 30-Jun-2008, P-1063615, A-43249, (PI) $1,000,000.00. . Boston Laser Corporation, IEEC Support-Boston Laser, 15-Apr-2007 to 14-Apr-2008, P-1063308, A-43105, (PI) $3,000.00. . Empire State Development Corp: New York State Center of Excellence in Small Scale Systems Integration & Packaging, 01-Apr-2007 to 31-Jan-2009, P-1071256, A-46601 (PI) $870,265.00. . Empire State Development Corp: New York State Center of Excellence in Small Scale Systems Integration & Packaging, 01-Apr-2007 to 31-Jan-2009, P-1071291, A-46601, (PI), $308,901.00. . Endicott Research Group Incorporated: ERG's Participating Membership in the IEEC, 19-Mar-2007 to 18-Mar-2008, P-1062156, A-42640, (PI) $3,000.00. . General Electric Company: IEEC Membership: General Electric, 01-Feb-2007 to 31­Jan-2008, P-1068155, A-45393, (PI) $60,000.00. . Lockheed Martin Systems Integration Company: Lockheed Martin's Support of the IEEC 2007, 01-Jan-2007 to 31-Dec-2007, P-1061367, A-42442, (PI) $60,000.00. Research Awards & Projects, 2006-2005 . STATS ChipPAC Ltd's: 2007 Membership in the IEEC, 01-Nov-2006 to 31-Oct-2007, P-1060400, A-42028, (PI) $39,985.00. . US Army Research Development & Engineering Command: Roll-to-Roll Manufacturing of Microelectronics on Flexible Substrates, 07-Sep-2006 to 06-Sep-2008, P-1058169, A-40973, (PI) $844,853.85. . Texas Instruments: TI Membership in the IEEC, 01-Sep-2006 to 31-Aug-2007, P-1058933, A-41329, (PI) $50,000.00. . Eastman Kodak Company: CAMM Support: Kodak Company, 01-Sep-2006 to 03-Sep­2008, P-1066183, A-44421, (PI) $60,000.00. . Endicott Interconnects Technologies Inc: EIT's Full Membership in the CAMM, 01­Sep-2006 to 31-Aug-2008, P-1060184, A-41952, (PI) $10,000.00. . General Electric Company: General Electric's Full Membership in the CAMM, 01-Sep­2006 to 31-Aug-2009, P-1060402, A-42029 (PI) $60,000.00. . Corning Incorporated: CAMM -Corning's Full Membership, 01-Sep-2006 to 31-Aug­2008, P-1060169, A-41945, (PI) $30,000.00. . NYS Department of Economic Development: The IEEC: CAT Program, 01-Jul-2006 to 30-Jun-2007, P-1056195, A-33110, (PI) $1,013,645.71. . Analog Devices: Support of a Graduate Student Dedicated to ADI Projects, 01-May­2006 to 30-May-2008, P-1054486, A-39385, (PI) $76,000.00. . Panavision SVI LLC: Panavision SVI's Participating Membership in the IEEC, 01­May-2006 to 30-Apr-2007, P-1055511, A-39717, 13,300.00. . NYS Department of Economic Development: Advanced Microelectronics Manufacturing on Flexible Substrates: The Next Revolution in Electronics Manufacturing E-CAT, 01-Mar-2006 to 28-Feb-2009, P-1056271, A-40005, $1,700,000.00. . Boeing Company: An Advanced Structural Integrity Program, 01-Jan-2006 to 31-Dec­2006, P-1046793, A-35906, (C0-PI) $24,000.00. Park, Dr. Seungbae . STATS ChipPAC Ltd's: STATS ChipPAC, Ltd's Membership in the IEEC, 01-Nov-2005 to 31-Oct-2006, P-1051732, A-38056, (PI) $39,980.00. . NASA Goddard Space Flight Center: Advanced Microelectronics Manufacturing: Roll-to-Roll Manufacturing of Microelectronics on Flexible Substrates, 01-Nov-2005 to 31-Oct-2007, P-1051568, A-37963, (PI) $950,826.00. . Corning Incorporated: Corning's Membership in the IEEC, 01-Oct-2005 to 30-Sep­2007, P-1051731, A-38037, (PI) $90,000.00. . US Army Research Development & Engineering Command: Development of a Sentinel Wireless Sensor Network to Detect and Predict CmL Bio Agents, 22-Sep-2005 to 30-Jun-2008, P-1051241, A-37806, (Co-PI) $266,094.00. Sadik, Dr. Omowunmi A . Texas Instruments: Texas Instruments Membership in the IEEC, 01-Sep-2005 to 31­Dec-2006, P-1051104, A-37719, (PI) $40,000.00. . Prismark Partners LLC: Tear Down Project, 01-Sep-2005 to 31-Aug-2007, P-1053875, A-39088, (PI) $40,000.00. . Oak Mitsui: Oak-Mitsui's Participating Membership in the IEEC, 21-Aug-2005 to 20­Aug-2007, P-1052950, A-38641 (PI) $20,000.00. . NYS Department of Economic Development: The IEEC: CAT Program, 01-Jul-2005 to 30-Jun-2006, P-1049093, A-33110, (PI) $1,055,703.00. . US Navy Office of Naval Research: Design, Packaging and Reliability of MEMS S&A Components and Systems, 01-May-2005 to 30-Sep-2006, P-1047711, A-36160, (Co-PI) $105,137.11. Park, Dr. Seungbae . Analog Devices: Analog Die Stress Project II, 01-Feb-2005 to 30-Jun-2006 P-1045490, A-35288, (PI) $48,481.00. . Multiple Sponsors: Univ of Albany SRC Award for Design Optimization of 3-D Stacked Wafers, 01-Feb-2005 to 31-Jan-2008, P-1050150, A-37275, (PI) $67,500.00. . Multiple Sponsors: Univ of Albany NYSTAR Award for Design Optimization of 3-D Stacked Wafers, 01-Feb-2005 to 31-Jan-2008, P-1050150, A-38681, (PI) $202,500.00. . US Display Consortium: Center for Advanced Microelectronics Manufacturing (CAMM), 03-Jan-2005 to 02-Jan-2010, P-1045527, A-035308, (PI) $400,000.00. . Universal Instruments Corporation, Universal Instruments Support of the IEEC, 01­Jan-2005 to 30-Sep-2006, P-1046087, A-35593, (PI) $30,000.00. Research Awards & Projects, 2004-2001 . General Electric Company: Nanoengineered Thermal Interfaces for Next Generation Microelectric Devices, 01-Oct-2004 to 30-Oct-2005, P-1044527, A-27155, (PI) $300,976.83. . Binghamton Semiconductor Pack: Participating Membership in the IEEC, 01-Jul-2004 to 30-Jun-2006, P-1043033, A-34029, (PI) $6,000.00. . NYS Department of Economic Development: The IEEC: CAT Program, 01-Jul-2004 to 30-Jun-2005, P-1041249, A-33110, (PI) $890,816.00. . Amphenol Aerospace Operations: Participating Membership in the IEEC, 23-Mar­2004 to 22-Mar-2008, P-1039625, A-32378, (PI) $17,500.00. . Samsung Electronics Co LTD: IEEC Membership, 01-Jan-2004 to 30-Nov-2006, P-1037974, A-31632, (PI) $120,000.00. . Universal Instruments Corporation: Universal Instruments IEEC Membership, 01-Jan­2004 to 30-Nov-2004, P-1038029, A-31666, (PI) $30,000.00. . NYS Energy Research and Development Authority: Optimizing Airflow Management Protocols in NY Data Centers, 24-Nov-2003 to 01-Sep-2006, P-1037748, A-31543, (PI) $247,533.00. . Analog Devices, Package Induced Die Stress Study, 01-Oct-2003 to 31-Jul-2004, P-1037854, A-31574, (PI) $40,000.00. . Health Resources and Services Admin: Health Care Facilities and Other Construction, 01-Sep-2003 to 30-Sep-2004, P-1036515, A-30867, (Co-PI) $196,712.00. Sonnenfeld, Dr. Gerald . Boston Laser Corporation: Participating Membership in the IEEC, 01-Sep-2003 to 31­Aug-2006, P-1034866, A-29958, (PI) $9,000.00. . NYS Department of Economic Development: The IEEC: NYSTAR 2003/2004 CAT Project, 01-Jul-2003 to 30-Jun-2004, P-1033619, A-29275, (PI) $1,000,000.00. . Binghamton Semiconductor Pack: Binghamton Semiconductor Packaging Participating Membership in the IEEC, 01-Jul-2003 to 30-Jun-2004, P-1035428, A­30264, (PI) $3,000.00. . Endicott Interconnects Technologies Inc.: EIT's Support of the IEEC, 01-Apr-2003 to 31-Mar-2008, P-1031502, A-28341, (PI) $270,000.00. . Multiple Sponsors: Miscellaneous Income from IEEC Services & Activities, 01-Mar­2003 to 30-Jan-2007, P-1030999, A-28127, (PI) $42,778.61. . Analog Devices: ADI's Membership in IEEC, 08-Feb-2003 to 07-Feb-2008, P-1030626, A-27985, (PI) $290,000.00. . Transit Video Security Systems: Participating Membership in the IEEC, 01-Jan-2003 to 31-Dec-2005, P-1029604, A-27525, (PI) $6,000.00. . IBM Corporation: IBM's Full Membership in IEEC, 17-Dec-2002 to 31-Dec-2007, P­1037432, A-31377, (PI) $300,000.00. . Analog Devices: Reliability Modeling of Ball Grid Array Packages, 16-Dec-2002 to 15­Jun-2003, P-1031383, A-28284, (PI) $7,623.00. . Analog Devices: Teardown of Six Switches, 15-Nov-2002 to 30-Jun-2003, P-1028691, A-27052, (PI) $15,000.00. . General Electric Company: Nanoengineered Thermal Interfaces for Next Generation Microelectric Devices, 01-Nov-2002 to 31-Oct-2004, P-1028917, A-27155, (PI) $505,287.17. . General Electric Company: Stress Modeling for Flip Chip Technology, 15-Oct-2002 to 31-Dec-2002, P-1028927, A-27160, (PI) $3,000.00. . Research Foundation of City University of New York: Compact Photonic Explorers Consortium, 01-Oct-2002 to 30-Sep-2004, P-1032116, A-28621, (PI) $90,000.00. . Analog Devices: Die Delamination Study, 01-Oct-2002 to 31-Mar-2003, P-1029793, A­27604, (PI) $5,921.57. . Oak Mitsui: Participating Membership in the IEEC, 21-Aug-2002 to 27-Aug-2005, P­1027329, A-26357, (PI) $30,000.00. . Analog Devices: Evaluation of Optical Assemblies -Investigation of Lid Sealing Failures, 01-Aug-2002 to 22-Feb-2003, P-1027253, A-26320, (PI) $3,000.00. . Binghamton Semiconductor Pack: Participating Membership in IEEC, 01-Jul-2002 to 30-Jun-2003, P-1028249, A-26821, (PI) $3,000.00. . Analog Devices: Finite Element Modeling of a Flip Chip Package, 01-Jul-2002 to 30­Sep-2002, P-1027571, A-26475, (PI) $4,182.79. . Sanmina-SCI Corporation: Participating Membership in IEEC, 01-Jun-2002 to 31­May-2003, P-1025575, A-25461, (PI) $10,000.00. . Amphenol Aerospace Operations: Participating Membership in the IEEC, 01-Jun-2002 to 31-May-2003, P-1025258, A-25289, (PI) $4,460.00. . National Science Foundation: REU Site: Research Opportunities for Undergraduates in the Field of Electronics Packaging, 01-Jun-2002 to 31-May-2005, P-1024074, A-24872, (PI) $144,226.11. . NYS Department of Economic Development: The IEEC: NYSTAR Designated Center for Advanced Technology, 16-Apr-2002 to 30-Jun-2003, P-1025418, A-25370, (PI) $1,000,000.00. . Analog Devices: 2002 IEEC Membership, 07-Jan-2002 to 07-Feb-2003, P-1021726, A-23879, (PI) $40,000.00. . Rainbow Displays Incorporated: Participating Membership in the IEEC, 01-Jan-2002 to 31-Dec-2002, P-1027204, A-26316, (PI) $3,000.00. . Universal Instruments Corporation: Universal's Support of the IEEC, 01-Jan-2002 to 30-Jun-2003, P-1029660, A-27545, (PI) $60,000.00. . Lockheed Martin Systems Integration Company: Support of the IEEC, 01-Jan-2002 to 31-Dec-2006, P-1022408, A-24043, (PI) $300,000.00 . IBM Corporation: Full Membership in the IEEC, 17-Dec-2001 to 31-Dec-2002, P-1025261, A-25290, (PI) $60,000.00. . Photon Vision Systems: Photon Vision Systems' Participating Membership in the IEEC, 15-Sep-2001 to 14-Sep-2002, P-1020263, A-23051, (PI) $3,000.00. . NYS Department of Economic Development: The IEEC: NYSTAR Designated Center for Advanced Technology, 01-Jul-2001 to 30-Jun-2002, P-1017860, A-21750, (PI) $1,000,000.00. . General Electric Company: General Electric's Membership in the IEEC, 01-Feb-2001 to 31-Jan-2007, P-1016545, A-21157, (PI) $330,000.00. . BAE Systems Controls Incorporated: BAE Systems Controls Support of the IEEC, 01­Jan-2001 to 31-Dec-2008, P-1014486, A-20050, (PI) $450,000.00. Research Awards & Projects, 2000-1998 . Oak Mitsui: Oak Mitsui's Participating Membership in the IEEC, 01-Nov-2000 to 31­Oct-2001, P-1014478, A-20046, (PI) $10,000.00. . Rainbow Displays Incorporated: ATP: Tiled Microdisplay Technology, 01-Nov-2000 to 31-Oct-2002, P-1015873, A-20796, (PI) $285,945.25. . Cryomedical Sciences Incorporated: Investigation Of Freezing Of Biological Tissue, 15-Oct-2000 to 31-Mar-2002, P-1006482, A-012337, (PI) $15,964.00. . Multiple Sponsors: S&F Account -Non RF Funded Users -Environmental Electron Microscope -B. Blackburn, 01-Oct-2000 to 23-Oct-2002, P-1006628, A-012114, (PI) $134.38. . Sanmina-SCI Corporation: Sanmina's Participating Membership In The IEEC, 25-Sep­2000 to 30-Jun-2001, P-1006369, A-012332, (PI) $3,000.00. . Cryomedical Sciences Incorporated: Cryomedical Sciences' Participating Membership In The IEEC, 01-Jul-2000 to 01-Feb-2002, P-1006363, A-011880, (PI) $3,000.00. . NYS Department of Economic Development: The IEEC: The NYS Center For Advanced Technology In Electronics Packaging, 01-Jul-2000 to 30-Jun-2001, P-1006394, A-010919, (PI) $1,162,586.00. . Lockheed Martin Control Systems: Lockheed Martin Control System's Support Of The IEEC at BU, 01-Jan-2000 to 31-Jul-2001, P-1006037, A-004275 (PI) $45,154.65. . Universal Instruments Corporation: Universal Instrument's Support Of The IEEC At BU, 01-Jan-2000 to 31-Jan-2002, P-1006025, A-011559, (PI) $135,000.00. . IBM Corporation: IBM'S Support of the IEEC at BU, 17-Dec-1999 to 25-Jan-2002, P-1006042, A-004282, (PI) $135,004.88. . Eastman Kodak Company: Eastman Kodak's Participating Membership In The IEEC, 01-Dec-1999 to 30-Jun-2001, P-1006251, A-010130, (PI) $10,000.00. . Performance Interconnects Incorporated: Performance Interconnects Participating Membership In The IEEC, 01-Nov-1999 to 31-Oct-2000, P-1006213, A-004508, (PI) $3,000.00. . J M Electronics Holding Company: Jm Electronics Holding Company Support Of The IEEC, 01-Oct-1999 to 30-Sep-2000, P-1006217, A-004513, (PI) $39,999.40. . International Flex Technologies: Full Membership In The IEEC, 01-Sep-1999 to 28­Feb-2002, P-1006223, A-004525, (PI) $100,000.00. . Prismark Partners LLC, Tear Down Project, 01-Sep-1999 to 31-Aug-2005, P­1006407, A-004584, (PI) $120,000.00. . NYS Department of Economic Development: The IEEC: The NYS Center For Advanced Technology In Electronics Packaging, 01-Jul-1999 to 30-Jun-2000, P-1006393, A-004566, (PI) $1,052,619.00. . Photo Mechanics Incorporated: Photomechanics' Participating Membership In The IEEC, 01-Mar-1999 to 28-Feb-2002, P-1006154, A-004433, (PI) $9,000.00. . CID Technologies: Cid Technologies Inc Participating Membership In The IEEC, 01­Mar-1999 to 31-Jul-2001, P-1006168, A-004452, (PI) $3,000.00. . Matco Electronics Group: The Matco Electronics Group's Support Of The IEEC, 01­Mar-1999 to 01-Jul-2002, P-1006172, A-004458, $98,000.00. . U Neek Solutions Incorporated: U Neek Solution's Participating Membership In The IEEC, 01-Mar-1999 to 31-Jul-2001, P-1006155, A-004435, (PI) $6,000.00. . Binghamton Semiconductor Pack: Binghamton Semiconductor Packaging's Participating Membership In The IEEC, 08-Feb-1999 to 31-Jul-2001, P-1006151, A­004428, (PI) $6,000.00. . Lockheed Martin Systems Integration Company: Lockheed Martin Federal System's Support Of The IEEC At BU, 09-Jan-1999 to 04-Jan-2003, P-1006038, A-004276, (PI) $155,000.00. . Rainbow Displays Incorporated: Rainbow Displays Participating Membership In The IEEC, 01-Jan-1999 to 31-Dec-2001, P-1006169, A-004453, (PI) $9,000.00. . National Science Foundation: Small Firms Collaborative R&D Project With Rainbow Displays, Endicott, NY, 01-Jan-1999 to 31-Dec-2000, P-1006141, A-004409, (PI) $198,493.17. . Multiple Sponsors: Service & Facilities Account -Off Campus Users -Shaker & Thermal Chamber -James Pitarresi, 01-Sep-1998 to 31-Aug-2002, P-1006631, A-004677, (PI) $1,784.03. . Multiple Sponsors: Service & Facilities Account -Off Campus Users -X-Ray Inspection System, 01-Aug-1998 to 31-Jul-2002, P-1006642, A-004689, (PI) $3,648.00. . Multiple Sponsors: Miscellaneous Income From IEEC Services & Activities, 01-Mar­1998 to 28-Feb-2003, P-1006111, A-004366, (PI) $23,027.04. . Multiple Sponsors: Service & Facilities Account -Non Rf Funded Users ­Environmental Electron Microscope -B. Blackburn,01-Oct-1996 to 30-Sep-2000, P­1006627, A-004660, (PI) $22,278.32. PUBLICATIONS Refereed Journals 1. Gebhart, B., B. Sammakia. “Transient and Steady State Numerical Solutions in Natural Convection,” Numerical Heat Transfer, Vol. 1, 1978, pages: 529-542. 2. Gebhart, B., Z. Qureshi, and B. Sammakia, “Measurements and Calculations of Transient Natural Convection in Air,” International Journal of Heat and Mass Transfer, Vol. 23, 1979, pages: 571-576. 3. Gebhart, B., B. Sammakia, “Transient Natural Convection Adjacent to a Vertical Flat Surface; The Thermal Capacity Effort,” Numerical Heat Transfer, Vol. 4, 1981, pages: 331-344. 4. Gebhart, B., Z. Qureshi, and B. Sammakia, “Measurements and Calculations of Transient Natural Convection in Water,” Journal of Heat Transfer Transactions of the ASME, Vol. 104, 1982, pages: 644-648. 5. Carey, V.P., B. Gebhart, and B. Sammakia, “Transient Mixed Convection Adjacent to a Vertical Flat Surface,” International Journal of Heat and Mass Transfer, Vol. 25.6, 1982, pages: 834-845. 6. Gebhart, B., T. Audunson, and B. Sammakia, “Transport Near a Horizontal Ice Surface Melting in Cold Saline Water,” J. Geophysical Research, Vol. 88.C5, 1983, pages: 2935­2942. 7. Gebhart, B., B. Sammakia, “Transport Near a Vertical Ice Surface Melting in Water of Various SalinityLevels,” International Journal of Heat and Mass Transfer, Vol. 26.10, 1983, pages: 1439-1452. 8. Gebhart, B., B. Sammakia, “Transport Adjacent to Ice Surfaces Melting in Saline Water: Visualization Experiments,” Int. Communications Heat Mass Transfer, Vol.11, 1984, pages: 25-34. 9. Carey, V.P., B. Gebhart and B. Sammakia, “Measurements and Calculations of Transient Mixed Convection in Air,” International Journal of Heat and Mass Transfer, Vol. 28.10, 1985, pages: 1837-1846. 10. Khalilolahi, A., B. Sammakia, “Unsteady Natural Convection Generated by a Heated Surface within an Enclosure,” Numerical Heat Transfer, Vol. 9, 1986, pages: 715-730. 11. Khalilolahi, A., B. Sammakia, “Transient Natural Convection near a Uniform Flux Surface with Appreciable Thermal Capacity,” International Communications in Heat and Mass Transfer, Vol.15.3, 1988, pages: 303-313. 12. Homa, T., B. Sammakia, and P. Vadala.,“A Transient Technique to Measure the Temperature Coefficient of Resistance for Thin Film Resistors,” Journal of Electronic Packaging, Transactions of the ASME, Vol. 111, (1989), pages: 143-148. 13. Khalilolahi, A., B. Sammakia, “The Thermal Capacity Effect upon Transient Natural Convection in a Rectangular Cavity,” Journal of Electronic Packaging, Transactions of the ASME, Vol. 112.4, (1990), pages: 357-366. 14. Carden, T.F., S.D. Reynolds, and B. Sammakia, “Thermal Enhancements for a Thin Film Chip Carrier,” IEEE Transactions on Components, Hybrids and Manufacturing Technology, Vol. 15.5, (1992). 15. Ramakrishna, K., G. Subbarayan, and B.G. Sammakia, “Effect of Non-Uniformities and Defects on PTH Strain during Assembly and Accelerated Thermal Cycling,” ASME Journal of Electronic Packaging, 1997. 16. Sathe, S., B. Sammakia, “Interaction of the System and Module Level Thermal Phenomena: A Flip Chip BGA Example,” Electronics Cooling, Vol. 4.2, (1998), pages: 14-22. 17. Questad, D., S.K. Tran, and B. Sammakia, “Adhesion Issues in Flip Chip on Organic Modules,” IEEE Transactions on Components and Packaging Technology, Vol. 22.4, (1999), pages: 519-524. 18. Questad, D., S.K. Tran, and B. Sammakia, “Void-Effect Modeling of Flip-Chip Encapsulation on Ceramic Substrate,” IEEE Transactions on Components and Packaging Technology, Vol. 22.4 (1999): 484-487. 19. Sathe, S., B. Sammakia, “A Numerical Study of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package,” Journal of Electronic Packaging, Vol. 122, (2000), pages: 107-114. 20. Sathe, S., B. Sammakia, “A Review of Recent Developments in Some Practical Aspects of Air-Cooled Electronic Packages,” Journal of Heat Transfer, Transactions of the ASME, Vol. 120, (1998), pages: 830-839. 21. Constable, J., G. Kendall, C. Sahay, B. Van De Wal, and B. Sammakia, “Acoustic Emission Analysis for Fatigue Prediction of Lap Solder Joints in Mode Two Shear,” International Journal of Damage Mechanics, (2001), pages: 256-276. 22. Murray, B., S. Watson, and B. Sammakia, “Computational Parameter Studyof Chip Scale Package Array Cooling,” IEEE Transactions on Components and Packaging Technology, Vol. 24.2, (2001), pages: 184-191. 23. Garimella, S.V., Joshi, Y.K., Bar-Cohen, A., Mahajan, R., Toh, K.C., Carey, V.P., Baelmans, M., Lohan, J., Sammakia, B., Andros, F., “Thermal Challenges in next generation electronic systems,” IEEE Transactions on Components and Packaging Technologies, Vol. 25, Issue 4, December 2002. 24. Ramakrishna, K., A.Shah, K. Srihari, and B. Sammakia, “A Numerical Study of the Thermal Performance of an Impingement Heat Sink-Fin Shape Optimization,” IEEE Transactions on Components and Packaging Technologies, Vol. 27.4, (2004), pages: 710­ 717. 25. Sathe, S., B. Sammakia, “An Analytical Study of the Optimized Performance of an Impingement Heat Sink,” Journal of Electronic Packaging, Transactions of the ASME, (2004), pages: 528-534. 26. Chaparala, S., C., G. Griffin, J. Jackson, T. McHugh, J. Pitarresi, B. Roggeman, B. Sammakia, “Effect of Geometry and Temperature Cycle on the Reliability of WLCSP Solder Joints,” IEEE Transactions on Components and Packaging Technologies, Vol. 28.8, (2005), pages: 441-448. 27. Ackler, H. D., P. Arunasalam, and B. Sammakia, “Microfabrication of Ultra-High Density Wafer-Level Thin Film Compliant Interconnects for Thru-Silicon-Via Based Chip Stacks,” Journal of Vacuum Science and Technology-Part B, Vol. 24.4, (2006). 28. Desai, A., J. Geer and B. Sammakia, “Models of Steady Heat Conduction in Multiple Cylindrical Domains,” Journal of Electronic Packaging, Vol. 128, (2006), pages: 10-17. 29. Desai, A., J. Geer, W. Jones, S. Mahajan, G. Subbarayan, and B. Sammakia, “A Numerical Study of Transport in a Thermal Interface Material Enhanced with Carbon Nanotubes,” Journal of Electronic Packaging, Vol. 128, (2006), pages: 92-97. 30. Tonapi, S., S. Sathe, and K. Srihari, B. Sammakia, “A Numerical Analysis of the Thermal Performance of Single Sided and Back-to-Back Tape Ball Grid Array Packages,” ASME Journal of Electronic Packaging, Vol. 128, (2006), pages: 305-310. 31. Shah, A., K. Ramakrishna, K. Srihari, and B. Sammakia, “Optimization Study for a Parallel Plate Impingement Heat Sink,” ASME Journal of Electronic Packaging, Vol. 128, (2006), pages: 311-318. 32. Bhopte, S., D. Agonafer, R. Schmidt, and B. Sammakia. “Optimization of Data Center Room Layout to Minimize Rack Inlet Air Temperature,” ASME Journal of Electronic Packaging, Vol. 128, (2006), pages: 380-387. 33. Park, SB., H.C. Lee and B. Sammakia, “Predictive Model for Optimized Parameters in Flip-Chip Packages and Assemblies”, IEEE Transactions on Components and Packaging Technologies, Vol. 30, No. 2, June 2007, pages: 294-301. 34. Shrivastava, S.K., and B. Sammakia, “Thermal Management of Biomaterials in a Rectangular Cavity Surrounded by a Phase Change Material”, IEEE Transactions on Advanced Packaging, Vol. 30, No. 4, November 2007, pages: 741-752 . 35. Mahajan, S.S., G. Subbarayan, and B. Sammakia, "Estimating Thermal Conductivity of Amorphous Silica Nanoparticles and Nanowires using Molecular Dynamics Simulations,” Physical Review E 76, 056701, (2007). 36. Geer, J., A. Desai and B. Sammakia, “Heat Conduction in Multilayered Rectangular Domains,” ASME Journal of Electronic Packaging, Vol. 129, (2007), pages: 440-451. 37. Kanuparthi, S., Ganesh Subbarayan, B. Sammakia, and Thomas Sigmund, “An Efficient Network Model for Determining the Effective Thermal Conductivity of Particulate Interface Materials,” IEEE Transactions on Components and Packaging Technologies, Vol. 31, No. 3, (2008), pages: 611-621. 38. Garimella, S.V., A.S. Fleischer, J.Y. Murthi, A. Keshavarzi, R. Prasher, C. Patel, S. H. Bhavnani, R. Venkatasubramanian, R. Mahajan, Y. Joshi, B. Sammakia, B.A. Myers, L. Chorosinski, M. Baelmans, P. Sathyamurthyand P. E Raad, “Thermal Challenges in Next Generation Electronic Systems,” IEEE Transactions on Components and Packaging Technologies, Vol. 31, No.4, December (2008). 39. Bergman, T.L., A. Faghri, and R. Viskanta, “Frontiers in Transport Phenomena Research and Education: Energy Systems, Biological Systems, Security, Information Technology and Nanotechnology,” Summary article of NSF sponsored workshop, B. Sammakia chaired the Information Technology session and co-wrote the summary, International Journal of Heat and Mass Transfer (IJHMT), Vol. 51, (2008), pages: 4599–4613. 40. Kanuparthi, S., M. Rayasam, G. Subbarayan, B. Sammakia, A. Gowda, S. Tonapi, “Hierarchical Field Compositions for Simulations of Near-percolation Thermal Transport in Particulate Materials,” Comput. Methods Appl. Mech. Engrg. Vol. 198, (2009), pages: 657–668. journal homepage: www.elsevier.com/locate/cma 41. Farnam, D.S., Sammakia, B., Ackler, H., & Ghose, K., “Comparative Analysis of Microchannel Heat Sink Configurations Subject to a Pressure Constraint,” Heat Transfer Engineering, Vol. 30, No. 1-2, February 2009, pages: 43-53. 42. Rayasam, M., S. Chaparala, D. Farnam, B. Sammakia, and G. Subbbarayan, “Thermal Solution Maps: A Strategy for Thermal Design of Three-Dimensional Packages,” Journal of Electronic Packaging, March 2009, Vol. 131, Iss. 1, 011015 (9 pages) DOI:10.1115/1.3077131. 43. Shrivastava, S., M. Iyengar, B. Sammakia, R. Schmidt and J. Van Gilder, “Experimental-Numerical Comparison for a High Density Data Center: Hot Spot Heat Fluxes in Excess of 500 W/ft2”, IEEE Transactions on Components and Packaging Technologies, Vol. 32, No.1, March 2009. 44. Kanuparthi, S., G. Subbarayan, T, Siegmund and B. Sammakia, “The Effect Of Polydispersivity On The Thermal Conductivity Of Particulate Thermal Interface Materials,” IEEE Transactions on Components and Packaging Technologies, Vol. 32, No.2, June (2009). 45. Wang, L., Jin Luo , Jun Yin, Hao Zhang, Jinhui Wu , Xiajing Shi, Elizabeth Crew , Zhe Xu, Qiang Rendeng , Susan Lu , Mark Poliks , Bahgat Sammakia and Chuan-Jian Zhong,“Flexible Chemiresistor Sensors: Thin Film Assemblies of Nanoparticles on a Polyethylene Terephthalate Substrate,” Article citation: Lingyan Wang, J. Mater. Chem., 2010, DOI: 10.1039/b920957c, (2009). 46. Davidson, D., B. Sammakia, “Squeezing Flow of a Power Law Fluid Between Grooved Plates,” Journal of Electronic Packaging, Transactions of the ASME, Vol. 131, Iss. 3, DOI: 10.1115/1.3144158, March (2009). 47. Zhou, F., B. Murray, and B. Sammakia, “Modeling Heat Transport in Thermal Interface Materials Enhanced with MEMS Based Microconnects”, IEEE Transactions on Components and Packaging Technologies, Vol. 33, No. 1, March (2010). 48. Farnam, D., B. Sammakia, and K. Ghose, “Thermal Design Criteria for Extraordinary Performance of Devices Cooled by Microchannel Heat Sink,” ASME Journal of Thermal Science and Engineering Applications, Vol.2, Iss.4, (2011). 49. Alzoubi, K., S.Lu, and B.Sammakia, “Experimental and Analytical Studies on the High Cycle Fatigue Of Thin Film Metal on PET Substrate for Flexible Electronics Applications,” IEEE Transactions on Components and Packaging Technologies, Vol. 1, No. 1, January (2011). 50. Alzoubi, K., S. Lu, B. Sammakia and M. Poliks, “Factor Effect Study For The High Cycle Bending Fatigue On PET Substrate For Flexible Displays Applications,” IEEE Journal of Display Technology, Vol. 7, No. 6, June (2011). 51. Pisipati, S., J. Geer, B. Sammakia, and B. Murray, “A Novel Alternate Approach For Multiscale Thermal Transport Using Diffusion In The Boltzmann Transport Equation,” International Journal for Heat and Mass Transfer, IJHMT, Received 7 October 2010; revised 5 March 2011; accepted 5 March 2011. Available online 18 April (2011). http://dx.doi.org/10.1016/j.ijheatmasstransfer.2011.03.046 52. Mahajan, S., G. Subbarayan, and B. Sammakia, “Estimating Kapitza Resistance Between Si-Sio2 Interface Using Molecular Dynamics Simulations,” IEEE Transactions on Components and Packaging Technologies, Vol. 1, No. 8, August (2011). 53. Venkatadri, V., B. Sammakia, K. Srihari and D. Santos, “A Review of Recent Advances in Thermal Management in Three Dimensional Chip Stacks in Electronic Systems,” Journal of Electronic Packaging, Transactions of the ASME, December (2011), Vol. 133 / 041011-1. 54. Alzoubi, K., M. Hamasha, S. Lu, and B. Sammakia, “Bending Fatigue Study of Sputtered ITO on Flexible Substrate,” IEEE Journal of Display Technology, Vol. 7, No. 11, November (2011). 55. MA Omole, VA Okello, V Lee, L Zhou, OA Sadik, C Umbach, B Sammakia, “Catalytic Reduction of Hexavalent Chromium Using Flexible Nanostructured Poly (amic acids)”, ACS Catalysis, Volume 1, pages 139-146, (2011). 56. S Bhopte, B Sammakia, M Iyengar, R Schmidt, “Numerical and Experimental Study of the Effect of Underfloor Blockages on Data Center Performance”, Journal of Electronic Packaging, page 133, 011007, (2011). 57. S Pisipati, J Geer, B Sammakia, B. Murray, “A Novel Alternate Approach For Multiscale Thermal Transport Using Diffusion In The Boltzmann Transport Equation”, International Journal of Heat and Mass Transfer, (2011). 58. K Alzoubi, S Lu, B Sammakia, and M Poliks, “Factor Effect Study for the High Cyclic Bending Fatigue of Thin Films on PET Substrate for Flexible Displays Applications”, Journal of Display Technology, Volume 7 (6), pages 348-355, (2011). 59. H Zhang, MD Poliks, B Sammakia, S Garner, J Miller, and J Lyon, “Micron-Sized Feature Overlay Alignment on Large Flexible Substrates for Electronic and Display Systems”, Journal of Display Technology, Volume 7 (6), pages 330-338, (2011). 60. K Alzoubi, MM Hamasha, S Lu, B Sammakia, “Bending Fatigue Study of Sputtered ITO on Flexible Substrate”, Display Technology, Journal of , Volume 7 (11), pages 593-600, (2011). 61. V Venkatadri, B Sammakia, K Srihari, D Santos, “A Review of Recent Advances in Thermal Management in Three Dimensional Chip Stacks in Electronic Systems”, Journal of Electronic Packaging, Page 133, Volume 041011, (2011). 62. B Dan, JF Geer, BG Sammakia, “Heat Conduction in a Rectangular Tube With Eccentric Hot Spots”, Journal of Thermal Science and Engineering Applications, Volume 3, 041002, (2011). 63. M. Ibrahim, S. Bhopte, B. Sammakia, B. Murray, M. Iyengar and R. Schmidt, “Effect of Transient Boundary Conditions and Detailed Thermal Modeling of Data Center Rooms,” IEEE Transactions on Components and Packaging Technologies, Volume 2, No. 2, February (2012). 64. S. Madduri, B.G. Sammakia, W. Infantolino, S.C. Chaparala, LC Hughes, JM Harris, “Performance Study of a 980 nm GaAs Based Laser Diode Chip in a Moisture Condensing Environment”, Journal Of Electronic Packaging, page 134 (1), (2012). 65. S. Madduri, W. Infantolino, and B.G. Sammakia, “An Experimental and Computational Study on Moisture Induced Epoxy Swelling in Non-hermetic Optoelectronic Packages”, Journal Of Electronic Packaging, page 134 (1), (2012). 66. L.Y. Zheng, D.S. Farnam, D. Homentcovschi, B.G. Sammakia, “A Porous Elastic Model for Bacterial Biofilms: Application To The Simulation Of Deformation Of Bacterial Biofilms Under Microfluidic Jet Impingement”, Journal Of Biomechanical Engineering, page 134 (5), 051003, (2012). 67. A. Tambat, H.Y. Lin, G. Subbarayan, D.Y. Jung, and B. G. Sammakia, “Simulations of Damage, Crack Initiation, and Propagation in Interlayer Dielectric Structures: Understanding Assembly-Induced Fracture in Dies”, Device and Materials Reliability, IEEE Transactions on Volume 12 (2), pages 241-254, (2012) 68. K. Alzoubi, M.M. Hamasha, L. Wang, H. Zhang, J. Yin, J. Luo, S. Lu, B. G. Sammakia, “Stability of Interdigitated Microelectrodes of Flexible Chemiresistor Sensors”, Display Technology, Journal of , IEEE Transactions Volume 8 (7), pages 377-384, (2012). 69. X. Xu, M. Meyers, B.G. Sammakia, B. Murray and C. Chen, “Performance And Reliability Analysis Of Hybrid Concentrating Photovoltaic Thermal Collectors With Tree Shaped Channel Nets Cooling System”, IEEE Transactions on Components and Packaging Technologies, Volume 3, No. 6, June (2013). 70. Song, Zhihang, Bruce T. Murray, and Bahgat Sammakia. "Airflow and temperature distribution optimization in data centers using artificial neural networks." International Journal of Heat and Mass Transfer 64 (2013): 80-90 71. Zheng, Leo Y., Robert B. Congdon, Omowunmi A. Sadik, Cláudia NH Marques, David G. Davies, Bahgat G. Sammakia, Leann M. Lesperance, and James N. Turner. "Electrochemical Measurements of Biofilm Development Using Polypyrrole Enhanced Flexible Sensors." Sensors and Actuators B: Chemical (2013). 72. Song, Zhihang, Bruce T. Murray, and Bahgat Sammakia. "A dynamic compact thermal model for data center analysis and control using the zonal method and artificial neural networks." Applied Thermal Engineering 62, no. 1 (2014): 48-57. 73. Pisipati, Subbalakshmi, Cheng Chen, James Geer, Bahgat Sammakia, and Bruce T. Murray. "Multiscale thermal device modeling using diffusion in the Boltzmann Transport Equation." International Journal of Heat and Mass Transfer 64 (2013): 286-303. 74. Xu, Xinqiang, Mark M. Meyers, Bahgat G. Sammakia, and Bruce T. Murray. "Thermal Modeling and Life Prediction of Water-Cooled Hybrid Concentrating Photovoltaic/Thermal Collectors." Journal of solar energy engineering 135, no. 1 (2013). 75. Song, Zhihang, Bruce T. Murray, and Bahgat Sammakia. "Numerical investigation of inter-zonal boundary conditions for data center thermal analysis." International Journal of Heat and Mass Transfer 68 (2014): 649-658. 76. Zhou, Siyi, Bahgat G. Sammakia, Bruce White, and Peter Borgesen. "Multiscale modeling of thermoelectric generators for the optimized conversion performance." International Journal of Heat and Mass Transfer 62 (2013): 435-444. 77. Song, Zhihang, Bruce T. Murray, and Bahgat Sammakia. "A Compact Thermal Model for Data Center Analysis using the Zonal Method." Numerical Heat Transfer, Part A: Applications 64, no. 5 (2013): 361-377. 78. Alzoubi, Khalid, Gihoon Choi, Mohammad M. Hamasha, Atif S. Alkhazali, John DeFranco, Susan Lu, Bahgat Sammakia, and Charles Westgate. "Comparisons of the Mechanical Behaviors of Poly (3, 4-ethylenedioxythiophene)(PEDOT) and ITO on Flexible Substrates." In MRS Proceedings, vol. 1493, pp. mrsf12-1493. Cambridge University Press, 2013. 79. Batayneh, Wafa, Hala Khalaf, and Bahgat G. Sammakia. "Neural Network Modeling of Parallel-Plain Fin Heat Sink." International Journal of Applied Science and Technology, no. 3 (2013). 80. Song, Zhihang, Bruce T. Murray, and Bahgat Sammakia. "Numerical investigation of inter-zonal boundary conditions for data center thermal analysis." International Journal of Heat and Mass Transfer 68 (2014): 649-658. 81. Congdon, Robert B., Alexander S. Feldberg, Natalie Ben-Yakar, Dennis McGee, Christopher Ober, Bahgat Sammakia, and Omowunmi A. Sadik. "Early detection of Candida albicans biofilms at porous electrodes." Analytical biochemistry 433, no. 2 (2013): 192-201. 82. Zheng, Leo Y., Robert B. Congdon, Omowunmi A. Sadik, Cláudia NH Marques, David G. Davies, Bahgat G. Sammakia, Leann M. Lesperance, and James N. Turner. "Electrochemical measurements of biofilm development using polypyrrole enhanced flexible sensors." Sensors and Actuators B: Chemical182 (2013): 725-732. 83. Gao, Tianyi, James Geer, and Bahgat Sammakia. "Nonuniform temperature boundary condition effects on data center cross flow heat exchanger dynamic performance." International Journal of Heat and Mass Transfer 79 (2014): 1048-1058. 84. Chen, Cheng, James Geer, and Bahgat Sammakia. "Sub-continuum thermal transport modeling using diffusion in the Lattice Boltzmann Transport Equation."International Journal of Heat and Mass Transfer 79 (2014): 666-675. 85. Gao, Tianyi, Bruce Murray, and Bahgat Sammakia. "Analysis of Transient and Hysteresis Behavior of Cross-flow Heat Exchangers under Variable Fluid Mass Flow Rate for Data Center Cooling Applications." Applied Thermal Engineering(2015). 86. Gao, Tianyi, Milnes David, James Geer, Roger Schmidt, and Bahgat Sammakia. "Experimental and numerical dynamic investigation of an energy efficient liquid cooled chiller-less data center test facility." Energy and Buildings91 (2015): 83-96. 87. Gao, Tianyi, Bahgat Sammakia, and James Geer. "Dynamic response and control analysis of cross flow heat exchangers under variable temperature and flow rate conditions." International Journal of Heat and Mass Transfer 81 (2015): 542-553. 88. Zhou, S., Sammakia, B. G., White, B., Borgesen, P., & Chen, C. (2015). Multiscale modeling of Thermoelectric Generators for conversion performance enhancement. International Journal of Heat and Mass Transfer,81, 639-645. 89. Gao, T., Geer, J., & Sammakia, B. (2015). Development and verification of compact transient heat exchanger models using transient effectiveness methodologies. International Journal of Heat and Mass Transfer, 87, 265-278. 90. Gao, T., Sammakia, B., Samadiani, E., & Schmidt, R. (2015). Steady State and Transient Experimentally Validated Analysis of Hybrid Data Centers.Journal of Electronic Packaging, 137(2), 021007. 91. Ranade, A. P., Jung, D. Y., Sammakia, B. G., Eilertsen, T., & Davis, T. (2016). Optimization study of Supercapacitor electrode material composition and thickness for enhanced performance of the Supercapacitor. une, 13, 15. 92. Gao, T., Geer, J., & Sammakia, B. (2015). Review and Analysis of Cross Flow Heat Exchanger Transient Modeling for Flow Rate and Temperature Variations. Journal of Thermal Science and Engineering Applications, 7(4), 041017. 93. Alkharabsheh, S. A., Sammakia, B. G., & Shrivastava, S. K. (2015). Experimentally Validated Computational Fluid Dynamics Model for a Data Center With Cold Aisle Containment. Journal of Electronic Packaging,137(2), 021010. 94. Alkharabsheh, S., Fernandes, J., Gebrehiwot, B., Agonafer, D., Ghose, K., Ortega, A., ... & Sammakia, B. (2015). A Brief Overview of Recent Developments in Thermal Management in Data Centers. Journal of Electronic Packaging, 137(4), 040801. Books 1. Gebhart, B., Y. Jaluria, R. Mahajan and B. Sammakia, Buoyancy Induced Flows and Transport. Washington, DC: Hemisphere Pub. Corporation, 1988 (Translated to Russian in 1991.) Print. 2. Joshi, Yogendra, Pramod Kumar, B. Sammakia, and M. Patterson. Energy Efficient Thermal Management of Data Centers. New York: Springer, 2012. 3. Iyengar, M., Geisler, K.J.L., and Sammakia, B., “Cooling of Microelectronic and Nanoelectronic Equipment, Advances and Emerging Research”, World Scientific, WSPCSeries in Advanced Integration and Packaging, Vol. 3, 2014 Book Chapters and edited books 1. Seraphim, D., R. Lasky, Li, C., “Thermal Enhancement,” Principles of Electronic Packaging, New York: McGraw-Hill, 1989, (Co-authored chapter on thermal management.) 2. Sammakia, B., K. Ramakrishna, “Thermal Management in Electronic Packaging and Systems.” Mechanical Engineering Handbook CRCnetBASE. Boca Raton, FL: CRC Press, 2001. Frank Kreith (Editor) . 3. Puttlitz, K. and Paul Totta, eds., “Thermal Management,” Area Array Interconnection Handbook, Boston: Kluwer Academic Publishers, 2001. , (Co­authored chapter on thermal management.) 4. Andros, F.E., B. Sammakia, “Integrated Circuit Packaging,” Encyclopedia of Physical Science and Technology, 3rd ed. Vol. 7, San Diego, CA: Academic Press, 2001. Print. 5. B Sammakia, S Bhopte, M Ibrahim, “Numerical Modeling of Data Center Clusters”, Energy Efficient Thermal Management of Data Centers, page 335, (2012) 6. Sammakia, B. (Ed.). (2015). Encyclopedia of Thermal Packaging: Thermal Packaging Tools/Ed.-in-chief Avram Bar-Cohen. Energy Optimization and Thermal Management of Data Centers. World Scientific. 7. Sammakia, B., Joshi, Y., Agonafer, D., Samadiani, E., & Bar-Cohen, A. (2015). Containment. In ENCYCLOPEDIA OF THERMAL PACKAGING: Thermal Packaging Tools (pp. 155-196). Refereed Conference Proceedings 1. Gebhart, B., B.G. Sammakia, and T. Audunson, eds., “Transport Near a Horizontal Ice Surface Melting in Cold Saline Water”, International Journal of Heat and Mass Transfer, 26 (10), pp. 1439-1452. Hamburg, Germany: Federal Republic of Germany, 1983. 2. Sammakia, B.G., “Unsteady Mixed Convection in Air, a Numerical and Experimental Study,” Proceedings of the ASME Winter Annual Meeting, New Orleans, LA, 1984, pages: 43-45. 3. Sammakia, B.G., “Modeling of Arctic Sea Ice Formation and Dissipation,” Proceedings at an ASME Conference, Arctic and Offshore Mechanics Symposium, New Orleans, LA, 1984. 4. Khalilolahi, A., M. H. Hamza, and B.G. Sammakia, eds. ”Transient Natural Convection Generated by a Hot Vertical Surface within an Enclosure,” Proceedings IASTED International Conference, Applied identification modeling and simulation, AIMS 84, ISBN0-88986-070-X, 1984, pages: 141-145. 5. Biber, C. and B.G. Sammakia, eds. “Transport from Discretely Heated Components in a Turbulent Channel Flow,” Proceedings at the ASME Winter Annual Meeting; Anaheim, CA, 86-WA/HT-68, 1986. 6. Homa, T., B. G. Sammakia, and P. Vadala, eds. “A Transient Technique to Measure the Thermal Coefficient of Resistance for Thin Films,” ASME Winter Annual Meeting; Boston, MA. 87-WA/EEP-4, 1987. 7. Coleman, M., B. G. Sammakia, and D. Agonafer, “Unsteady Buoyancy Induced Flow in an Enclosure,” ASME Winter Annual Meeting; Boston, MA, 87-WA/EEP-10, 1987. 8. Khalilolahi, A. and B. G. Sammakia, eds. “Transient Mixed Convection In Air Adjacent To Discrete Uniform Flux Heat Sources,” Proceedings of the ASME Symposium on Numerical Simulation of Convection in Electronic Equipment Cooling; HTD-Vol. 121, San Francisco, CA, 1989. 9. Khalilolahi, A., and B. G. Sammakia, eds. “Transient Convection Adjacent to Discrete Components in the Presence of a Weak Opposing Pressure Field,” Proceedings of the ASME Winter Annual Meeting; Dallas, TX, 1990. 10. Subbarayan, G., K. Ramakrishna, B. G. Sammakia and P.C. Chen, eds. “Mechanical Integrity of VIAS in a Thin-Film Package during Manufacturing, Assembly and Stress Test,” Proceedings of IEEE Electronic Components and Technology Conference (ECTC); Orlando, FL, 1993. 11. Subbarayan, G., K. Ramakrishna and B.G. Sammakia, “The Impact of Interfacial Adhesion on PTH and VIA Reliability,” Application of Fracture Mechanics in Electronic Packaging and Materials, ASME, 1995; EEP-vol. 11/MD-vol. 64 12. Ramakrishna K., and B.G. Sammakia, “Analysis of Strains in Plated Through Holes During Current Induced Thermal Cycling of a Printed Wiring Board,” ASME International Mechanical Engineering Congress and Exposition, San Francisco, CA, 1995; 95-WA/EEP-5. 13. Sathe S., and B.G. Sammakia, “Natural Convection in an Open Ended Horizontally Heated Cavity: A Numerical Study with Applications to Laptop Computers,” National Heat Transfer Conference, Vol. 1, HTD-Vol. 303, 1995, pages: 81-93. 14. Sathe, S., B.G. Sammakia, A.C. Wong, and V. H. Mahaney, “A Numerical Study of a High Performance Air-cooled Impingement Heat Sink,” National Heat Transfer Conference-Vol. 1, HTD-Vol. 303, 1995, pages: 43-53. 15. Sathe S. and B. G. Sammakia, “A Numerical Studyof the Thermal Performance of a Tape Ball Grid Array (TBGA) package,” National Heat Transfer Conference, Austin, TX, August 1996, page 83. 16. Stutzman, R., S. Sathe, and B. G. Sammakia, “Macro and Micro Thermal Model of an Elevated Temperature Dielectric Breakdown in Printed Circuit Boards,” ASM 22nd International Symposium for Test and Failure Analysis (ISTFA 96), Los Angeles CA, 1996, pages 313-316. 17. Chen, W.T., D. Questad, D. Read, and B.G. Sammakia, “Opportunities and Needs for Interfacial Fracture Mechanics in Microelectronic Packaging Industry,” ASME WAM, 1997. 18. Niu, T.M., B.G. Sammakia, and S. Sathe, “Void Modeling in Encapsulated Multilayer Ceramic and Multilayer Polyimide Ceramic Flip Chip Packages,” Itherm 98, Seattle, WA, May 1998. 19. Tran, S.K., D. Questad, and B.G. Sammakia, “Adhesion Issues in Flip Chip on Organic Modules,” Itherm 98 Seattle, WA, May 1998. 20. Sathe, S. and B.G. Sammakia, “Some Thermal Issues that Arise in the Development, Qualification, and Manufacturing of Electronic Packages,” presentation at the NSF/ASME Workshop in conjunction with the 1998 ASME International Mechanical Engineering Congress and Exposition, November 18-19, 1998, pages: 8-11. 21. Sammakia, B.G. and S. Sathe, “Thermal Issues that Arise due to Manufacturing Processes; Evaluation and Measurement Techniques,” Electronics Manufacturing Issues, DE-Vol. 104, ASME 1999, November 14-19, 1999, pages: 121-138. 22. Sathe, S. and B.G. Sammakia, “Some Aspects of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package,” Proceedings of ASME 1998, Manufacturing Science and Engineering Division, MED-Vol. 8, 1998, pages: 747-756. 23. Watson, S., B. Murray, and B. G. Sammakia, “Computational Parameter Study of Chip Scale Package Array Cooling,” Proc. 2000 InterSociety Conference on Thermal Phenomena Itherm 2000, Las Vegas, NV, May 23-26, 2000, pages: 37-43. 24. Tonapi, S., K. Srihari, S. Sathe, and B G. Sammakia, “Parametric Studies of the Thermal Performance of a Tape Ball Grid Array(TBGA) Package,” Proceedings of the ASME Manufacturing in Engineering Division -2000, Orlando, FL, November 5-10, 2000, MED-Vol. 11, pages: 425-431. 25. Morris, J. and B. G. Sammakia, “Current and Future Research in Electronics Packaging at Binghamton University,” 2000 Government Microcircuit Applications Conference, Anaheim, CA, March 20-23, 2000, pages: 396-399. 26. Chouta, P., D. Santos, K. Srihari, and B.G. Sammakia, F. Andros, and M. DiPietro, “A Shear Strength Study of Lead-Free Solder Spheres for BGA Applications on Different Pad Finishes,” 2001 Proceedings Pan Pacific Microelectronics Symposium, Kauai, HI, February 13-16, 2001, pages: 11-28. 27. Sathe S. and B. G. Sammakia, “Thermal Model of Buried Resistors and Design Guidelines for Buried Components,” EEP-Vol. 26-1, Advances in Electronic Packaging – 1999, Volume 1, ASME, 1999. 28. Awasthi, A., S. McKeown, C. Sahay, and B.G. Sammakia, “Selection of Method for Fatigue Life Prediction Under Random Loading,” IMECE 2001, session EEP-12, November, 2001, New York, N.Y. 29. Santos, D., K. Srihari, and B. G. Sammakia, “Industry University Research in Electronics Manufacturing: The Binghamton University Model,” proceedings of the SMTA-Chicago, October, 2001, pages 672-675. 30. Tonapi, S., S. Sathe, B. G. Sammakia, and K. Srihari, “Parametric Studies of the Thermal Performance of Back-to-Back Tape Ball Grid Array (TBGA) Packages,” 51st ECTC, Orlando, FL, May 2001, pages: 738-743. 31. Greenfield, P., J. Andresakis and B.G. Sammakia, “An FEA Study of Image Transfer in Printed Wiring Boards,” IPC 2002, pages: S03-2-1 – S03-2-8. 32. Greenfield, P., J. Pitarresi, G. Lehmann, D. Skinner, J. Lee, and B. G. Sammakia, “A Lamination Study of a Composite LCD Flat Panel Display,’ proceedings InterSociety Conference on Thermal Phenomena (Itherm2002), San Diego, CA, May, 2002, pages: 1001 -1006. 33. Shah, A., B. G. Sammakia, K. Srihari, and K. Ramakrishna, “A numerical analysis of the performance of a parallel plate heat sink,” proceedings InterSociety Conference on Thermal Phenomena (Itherm2002), San Diego CA, May, 2002, pages 710-717. 34. Guttikonda S. and B. G. Sammakia, "Comparative Analysis of two heat spreader designs for a Wire Bond TBGA Package,” proceedings InterSociety Conference on Thermal Phenomena (Itherm2002), San Diego, CA, May, 2002, pages: 559-571. 35. Watson S. and B. G. Sammakia, “A parametric study of the thermal performance of chip scale packages with flat plate heat sinks,” proceedings InterSociety Conference on Thermal Phenomena (Itherm2002), San Diego, CA, May, 2002, pages: 276-284 36. Chaparala, S., J. Pitarresi, B. G. Sammakia, L. Nguyen, V. Patwardhan, L. Zhang, and N. Kelkar, “A Parametric Predictive Solder Joint Reliability Model for Wafer Level Chip Scale Package,” Proceedings ECTC 2002, , May 31, 2002, San Diego, CA, pages: 1323 – 1328. 37. Srihari K. and B. G. Sammakia, “Industry -University Partnership in Graduate Research and Education,” Proceedings ECTC 2002. , May 31, 2002, San Diego, CA, pages: 768 – 771. 38. Tonapi, S., R. Fillion, B. G. Sammakia, F.J. Schattenmann, H.S. Cole, and J. D. Evans, "An Overview of Thermal Management of Next Generation Microelectronic Devices,” Proceedings of the 13th Advanced Semiconductor Manufacturing Conference 2003. 39. Mahajan, S., G. Subbarayan, B. G. Sammakia, and W. Jones, “Molecular Dynamics Simulation of Nanotube-Polymer Composites for use as Thermal Interface Material,” Proceedings of 2003 ASME, International Mechanical Engineering Congress and Exposition, Washington, D.C., November 15-21, 2003. 40. Sathe, S. and B. G. Sammakia, “An Analytical Study of the Optimized Performance of An Impingement Heat Sink,” Proceedings of 2003 ASME, International Mechanical Engineering Congress and Exposition, Washington, DC, November 15-21, 2003. 41. Desai, A., S. Mahajan, G. Subbarayan, W. Jones, J.Geer, and B.G. Sammakia, “An Analytical Study of Transport in a Thermal Interface Material Enhanced with Carbon Nanotubes,” Proceedings of Itherm 2004 (CD), The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, June 1-4, 2004, pages: 403-409. 42. Chaparala,S.C., B.D. Roggeman, J.M. Pitarresi, B.G. Sammakia, J. Jackson, G. Griffin, and T. McHugh, “Effects of Geometry and Temperature Cycle on the Reliability of WLCSP Solder Joints,” Proceedings of Itherm 2004 (CD), The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, June 1-4, 2004, pages: 287-295. 43. Cuddalorepatta, G., J.M. Pitarresi, and B.G. Sammakia, “Mechanical Modeling of Tiled Liquid Crystal on Silicon (LcoS) Microdisplay,” Proceedings of Itherm 2004 (CD), The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 383-390, Las Vegas, NV, June 1-4, 2004. 44. Agonafer, D., J.Markell, B.G. Sammakia, and G.Lehman, “Numerical Investigation of Enclosure Effects on Spot Cooling Devices,” Proceedings of Itherm 2004 (CD), The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, June 1-4, 2004, pages: 339-343. 45. Park, S.B., B.G. Sammakia, and K. Raghunathan, “Predictive Model for Optimized Design Parameters in Flip-Chip Packages,” Proceedings of Itherm 2004 (CD), The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, June 1-4, 2004, pages: 458-464. 46. Choubey, A., F. Andros, and B.G. Sammakia, “Study of Assembly Processes for Liquid Crystal on Silicon (LcoS) Microdisplays,” Proceedings of Itherm 2004 (CD), The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, June 1-4, 2004, pages: 77-84. 47. Bahadur, R., B.G. Sammakia, and F. Andros, “Thermal Management of a Microdisplay Engine Assembly,” Proceedings of Itherm 2004 (CD), The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, June 1-4, 2004, pages: 381-388. 48. Shrivastava, S., B. G. Sammakia, “Thermal Management of Biomaterials in a Rectangular Cavity Surrounded by a Phase Change Material,” Proceedings of Itherm 2004 (CD), The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Las Vegas, NV, June 1-4, 2004, pages: 108-120. 49. Arunasalam, P., H.D. Ackler, and B.G. Sammakia, “Smart Three Axis Compliant (STAC) Interconnect: An Ultra-High Density MEMS Based Interconnect for Wafer-Level Ultra-Thin Die Stacking Technology,” ECTC 2005, Lake Buena Vista, FL, 5/31/2005-6/3/2005. 50. Arunasalam, P., H.D. Ackler, S.Makhar, and B.G. Sammakia, “A Novel MEMS Based Ultra-High Density Interconnect for Wafer-Level Ultra-Thin Die Stacking Technology,” IMAPS 2005, Philadelphia, PA, September 25-29, 2005. 51. Park, S.B., R. Joshi, and B. G. Sammakia, “Thermomechanical behavior of organic and ceramic flip chip ball grid array packages under power cycling,” Semi-Therm 2005, San Jose, CA, March 15-17/2005. 52. Zhang, X., S. Kanuparthi, G. Subbarayan, B. Sammakia, and S. Tonapi, “Hierarchical Modeling and Trade-off Studies in Design of Thermal Interface Materials,” Proceedings ASME InterPACK '05, IPACK2005-73259, San Francisco, CA, July 17-22, 2005. 53. Bhopte, S., D. Agonafer, R.Schmidt, and B. G., Sammakia, “Optimization of Data Center Room Layout to Minimize Rack Inlet Air Temperature,” Proceedings ASME InterPACK '05, IPACK2005-73027, San Francisco, CA, July 17-22, 2005. 54. Shrivastava, S., B.G., Sammakia, R.Schmidt, and M. Iyengar, “Comparative Analysis of Different Data Center Airflow Management Configurations,” Proceedings ASME InterPACK '05, IPACK2005-73235, San Francisco, CA, July 17-22, 2005. 55. Shrivastava, S., B. G., Sammakia, “Transient Mixed-Convection with Applications to Cooling of Biomaterials,” Proceedings ASME InterPACK '05, IPACK2005-73235, San Francisco, CA, July 17-22, 2005. 56. Iyengar, M., R. Schmidt, A. Sharma, G. McVicker, S. Shrivastava, S. S. Yasuo Amemiya, H. Dang, T. Chainer, and B.G. Sammakia, “Thermal Characterization of Non-raised Floor Air Cooled Data Centers Using Numerical Modeling,” Proceedings ASME InterPACK '05, IPACK2005-73387, San Francisco, CA, July 17-22, 2005. 57. Chaparala, S.C. F.E. Andros, W. Infantolino, B.G. Sammakia, S.C. Guttikonda, J. Zhao, and D. Sengupta, “Die Stress Analysis in Stacked Die Chip Scale Packages (SCSP),” Proceedings ASME InterPACK '05, IPACK2005-73085, San Francisco, CA, July 17-22, 2005. 58. Xiao, Q., W.D. Armstrong, J.M. Pitarresi, S.C. Chaparala, B.D. Roggeman, B. G. Sammakia, and L. Nguyen, “Constitutive Relationship Development, Modeling and Measurement of Heat Stressing of Micro-SMD Assembly with Sn3.9Ag0.6Cu SAC Alloy,” Proceedings ASME InterPACK '05, IPACK2005-73239, San Francisco, CA, July 17-22, 2005. 59. Shrivastava S. and B.G. Sammakia, “Inclined Cavity Effects with Applications to Cooling of Biomaterials,” Proceedings of IMECE2005, Paper IMECE2005-81633, Orlando, FL, November 5-11, 2005. 60. Shrivastava, S., B.G. Sammakia, M. Iyengar, and R. Schmidt, “Significance Levels of Factors for Different Airflow Management Configurations of Data Centers,” Proceedings of IMECE2005, Paper IMECE2005-81607, Orlando, FL, November 5-11, 2005. 61. Desai, A., J. Geer, and B.G. Sammakia, “Analytical Model of Heat Conduction in a Tubular Geometry with Application to a Nano-Structured Thermal Interface,” Proceedings of IMECE2005, Paper IMECE2005-79732, Orlando, FL, November 5-11, 2005. 62. Desai, A., J. Geer, and B.G. Sammakia, “Heat Conduction in Three Dimensional Stacked Packages,” Proceedings of IMECE2005, Paper IMECE2005-79771, Orlando, FL, November 5-11, 2005. 63. Kanuparthi, S., X. Zhang, G. Subbarayan, B. G. Sammakia, A. Gowda, and S. Tonapi., “Full-Field Simulations of Particulate Thermal Interface Materials: Separating the Effects of Random Distribution from Interfacial Resistance,” 10th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2006), San Diego, CA, May 30-June 2, 2006. 64. Mahajan, S., G. Subbarayan, and B.G. Sammakia, “Thermal Conductivityof Amorphous Silica Using Non-Equilibrium Molecular Dynamics Simulations,” 10th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2006), San Diego, CA, May 30-June2, 2006. 65. Kanuparthi, S., X. Zhang, G. Subbarayan, B.G. Sammakia, T. Siegmund, A. Gowda, and S. Tonapi, “Random Network Percolation Models for Particulate Thermal Interface Materials,” 10th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2006), San Diego, CA, May 30-June2, 2006. 66. Shrivastava, S.K., M. Iyengar, B.G. Sammakia, R. Schmidt, and J.W. VanGilder, “Experimental-Numerical Comparison for a High-Density Data Center: Hot Spot Fluxes in Excess of 500 W/FT2,” 10th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2006), San Diego, CA, May 30-June2, 2006. 67. Shrivastava, S.K., J.W. VanGilder, and B.G. Sammakia, “A Statistical Prediction of Cold Aisle End Airflow Boundary Conditions,” 10th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2006), San Diego, CA, May 30-June2, 2006. 68. Bhopte, S., B.G. Sammakia, R.Schmidt, M.K. Iyengar, and D. Agonafer, “Effect of Under Floor Blockages on Data Center Performance,” 10th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2006), San Diego, CA, May 30-June2, 2006. 69. Desai, A., J. Geer, and B. G. Sammakia, “A Statistical Analysis of Thermal Interface Materials Enhanced by Vertically Aligned Carbon Nanotubes,” 10th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2006), San Diego, CA, May 30-June2, 2006. 70. Arunasalam, P., H.D. Ackler, and B.G. Sammakia, “Design, Fabrication and Implementation of Smart Three Axis Compliant Interconnects for Ultra-Thin Chip Stacking Technology,” 56th Electronic Components and Technology Conference Proceedings, San Diego, CA, May 30-June 2, 2006, pages: 1147-1153. 71. Desai, A., J. Geer and B.G. Sammakia, “A Technical Review of Studies on Temperature Distribution in Three Dimensional Stacked Packages”, Thermes 2007: Thermal Challenges in Next Generation Electronic Systems, Suresh V. Garimella and Amy, S. Fleischer (editors), 2007, Millpress, Rotterdam, ISBN 978-90-5966-051-9. 72. Desai, A., J. Geer and B.G. Sammakia, “Experimental Measurements of Temperature Distribution in Three Dimensional Stacked Package,” Proceedings of IPACK 2007, IPACK2007-33045, Vancouver, BC, Canada, July 8-12, 2007. 73. Shrivastava, S.K., J.W. Van Gilder, and B.G. Sammakia, “Data Center Cooling Prediction using Artificial Neural Network,” Proceedings of IPACK 2007, IPACK2007­33432, Vancouver, BC, Canada, July 8-12, 2007. 74. Bhopte, S., B.G. Sammakia, M.K. Iyengar, and R. Schmidt, “Experimental Investigation of the Impact of Under Floor Blockages on Flow Distribution in a Data Center Cell,” Proceedings of IPACK 2007, IPACK2007-33540, Vancouver, BC, Canada, July 8-12, 2007. 75. Bhopte, S., B.G. Sammakia, and B. Murray, “Mixing Enhancement In Two Component Microchannel Flow-Geometric And Pulsed Flow Effects,” Proceedings of IMECE2007, ASME International Mechanical Engineering Congress and Exposition, Seattle, Washington, USA, November 11-15, 2007. 76. Machiraju H., W. Infantolino, B. G. Sammakia, and M. Deeds, “Thermal Analysis Of MEMS Actuator Performance”, Proceedings of IMECE2007, ASME International Mechanical Engineering Congress and Exposition, Seattle, Washington, USA, November 11-15, 2007. 77. Farnam, D., B.G. Sammakia, H. Ackler, and K. Ghose, (2007), “Comparative Analysis of Microchannel Cooling Schemes Subject to a Pressure Constraint,” Proceedings of the 5th International Conference on Nanochannels, Microchannels and Minichannels, ICNMM2007. 78. Bhopte, S., B. G., Sammakia, and B. Murray, “Geometric Modifications to Simple Microchannel Design for Enhanced Mixing,” 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2008), Orlando, FL, May 28-31, 2008. 79. Farnam, D., B. G. Sammakia, and K. Ghose, “Development of a Complete Transient Microchannel Heat Sink Model,” 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2008), Orlando, Fl, May 28-31, 2008. 80. Chaparala, S., F. Andros, W. Infantolino, and B.G. Sammakia, “A New Technique for Calibrating Piezoresistive Stress Sensor Chips,” 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2008), Orlando, Fl, May 28-31, 2008. 81. Farnam D. and B.G. Sammakia, “Assessment of the Performance of Dielectric Fluids in Microchannel Heat Sinks,” 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2008), Orlando, FL, May 28-31, 2008. 82. Kanuparthi, S., G. Subbarayan, B.G. Sammakia, and T. Siegmund, “Microstructural Characteristics Influencing the Effective Thermal Conductivity of Particulate Thermal Interface Materials,” 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2008), Orlando, Fl, May 28-31, 2008. 83. Bhopte, S., B.G. Sammakia, and V. Calmidi, “A Study of the Thermal Characterization of a High Performance Flip Chip Package,” 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2008), Orlando, Fl, May 28-31, 2008. 84. Shrivastava, S., J. W. VanGilder, and B.G. Sammakia, “Optimization of Cluster Cooling Performance for Data Centers,” 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2008), Orlando, Fl, May 28-31, 2008. 85. Gondipalli, S., S. Bhopte, B.G. Sammakia, M.Iyengar, and R.Schmidt, “Effects of Isolating Cold Aisles on Rack Inlet Temperature,” 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2008), Orlando, Fl, May 28-31, 2008. 86. Mahajan, S., G. Subbarayan, and B.G. Sammakia, “Estimating Kapitza Resistance Between Si-SiO2 Interrface Using Molecular Dynamics Simulations,” 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2008), Orlando, Fl, May 28-31, 2008. 87. Zhou, F., B. Murray, and B.G. Sammakia, “Modeling Heat Transport in Thermal Interface Materials Enhanced with MEMS Based Microconnects,” 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2008), Orlando, FL, May 28-31, 2008. 88. Madduri, S. W. Infantolino, and B.G. Sammakia, “A Review of Non-Hermetic Optoelectronic Packaging”, 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2008), Orlando, FL, May 28-31, 2008. 89. Poranki, S., N. Nagarur, and B.G. Sammakia, “Emerging Technology Evaluation – A Case of Flexible Electronics,” Center for Advanced Microelectronics Manufacturing (CAMM), State University of New York at Binghamton, 2009 Flexible Electronics and Displays Conference, Phoenix, Arizona, February 2009. 90. Zhang, H., M.D. Poliks, and B.G. Sammakia, “Precision overlay registration of micron sized features on unsupported flexible films,” Center for Advanced Microelectronics Manufacturing (CAMM), 2009 Flexible Electronics and Displays Conference, Phoenix, Arizona, February 2009. 91. Gondipalli, S., B.G. Sammakia, and G.R.,Ahmed, “Improving the Performance of an Impingement Heat Sink by Modifying the Fin Shapes,” Proceedings of the ASME 2009 InterPACK Conference, IPACK2009-89076, San Francisco, California, USA, July 19-23, 2009. 92. Karajgikar, S., D. Agonafer, K. Ghose, B.G. Sammakia, C. Amon, and G. R. Ahmed “Development of a Numerical Model for Non-Uniformly Powered Die to Improve Both Thermal and Device Clock Performance,” Proceedings of the ASME 2009 InterPACK Conference, IPACK2009-89188, San Francisco, CA, USA, July 19-23, 2009. 93. Gondipalli, S., B. G. Sammakia, S.Bhopte, R. Schmidt, M.K. Iyengar, and B.Murray “Optimization of Cold Aisle Isolation Designs for a Data Center with Roofs and Doors using Slits,”, Proceedings of the ASME 2009 InterPACK Conference, IPACK2009­89203, San Francisco, CA, USA, July 19-23, 2009. 94. Alzoubi, K., S. Lu, B.G. Sammakia, and M.Poliks, “Experimental Study of the High Cycle Fatigue of Thin Film Metal on Polyethylene Terephthalate for Flexible Electronics Applications,” Proceedings of the ASME 2009 InterPACK Conference, IPACK2009­89247, San Francisco, California, USA, July 19-23, 2009. 95. Madduri, S., B. G. Sammakia, W. Infantolino, S.C. Chaparala, L.C. Hughes, and J. M. Harris, “Performance Study of a GaAs based Laser Diode Chip in a Condensing Environment”, Proceedings of the ASME 2009 InterPACK Conference, IPACK2009­89115, San Francisco, California, USA, July 19-23, 2009. 96. Dan, B., S. Kanuparthi, G. Subbarayan, and B.G. Sammakia, “An Improved Network Model for Determining the Effective Thermal Conductivity of Particulate Thermal Interface Materials,” Proceedings of the ASME 2009 InterPACK Conference. IPACK2009-89116, San Francisco, CA, USA, July 19-23, 2009. 97. Ta-Hsuan L., F. Andros, S. Lu, and B.G. Sammakia, “Process and Reliability of Copper Column Flexible Flip Chip Connection (F2C2),” Electronics Packaging Technology Conference, 2008, EPTC 2008, 10th, Publication Date: 9-12 Dec. 2008, page(s): 1316­1320, Singapore, ISBN: 978-1-4244-2117-6, INSPEC Accession Number: 10445057, Digital Object Identifier: 10.1109/EPTC.2008.4763613, Current Version Published: 2009-01-27. 98. Kalkundri, K. F. Andros, and B.G. Sammakia, “An Experimental Setup and Procedure for Thermal Resistance Measurements of a Thermal Interface Material,” 2010 TMS (The Minerals, Metals and Minerals Society) Annual Meeting, Electronic, Magnetic and Photonic Materials Division, Seattle WA, February, 2010. 99. An overview of thermal management of electronic systems research at the Small Scale Systems Integration and Packaging Center, (S3IP), 12th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2010), Las Vegas Nevada, June 2-5, 2010. (Invited paper for Achievement award). 100. Chauhan, A., B.G. Sammakia, K. Ghose, G.R.Ahmed, and D. Agonafer , “Hot 12th Spot Mitigation using Single-Phase Microchannel cooling for Microprocessors,” Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2010), Las Vegas Nevada, June 2-5 2010. 101. Chakravorty, S., B.G. Sammakia, K. Srihari, and G. R.Ahmed, “Impingement 12th Heat Sink Optimization for Microprocessors with Significant Hot Spots,” Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2010), Las Vegas Nevada, June 2-5, 2010. 102. Gondipalli, S., S. Bhopte, B.G. Sammakia and V. Calmidi, “Numerical and Experimental study of the Effect of Thermocouple Wire Attachment on Thermal Characterization of a High Performance Flipchip Package,” 12th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2010), Las Vegas Nevada, June 2-5, 2010. 103. Ibrahim, M., S. Gondipalli, S. Bhopte, and B.G. Sammakia, “Numerical Modeling Approach to Dynamic Data Center Cooling,” 12th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2010), Las Vegas Nevada, June 2-5, 2010. 104. Gondipalli, S., M. Ibrahim, S. Bhopte, B. G., Sammakia, B. Murray, K. Ghose, M.K. Iyengar and R. Schmidt, “Numerical Modeling of Data Center with Transient Boundary Conditions 12th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2010), Las Vegas Nevada, June 2-5, 2010. 105. Bhopte, S, B.G. Sammakia, and B.Murray, “Numerical Study of a Novel Passive Micromixer Design,” 12th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2010), Las Vegas Nevada, June 2-5, 2010. 106. B. Dan, B.G. Sammakia, and G. Subbarayan, “On Refining the Parameters of a Random Network Model for Determining the Effective Thermal Conductivity of Particulate Thermal Interface Materials,” 12th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2010), Las Vegas Nevada, June 2-5, 2010. 107. Bhopte, S., S. Desu, and B.G. Sammakia, “An Integrated Nano-Structured Heat Spreader for High Heat Flux Electronic Systems”, Proceedings of International Heat Transfer Conference, IHTC 14, August 8-13, 2010, Washington, DC, USA. 108. Alzoubi, K., A.Qasaimeh, S. Lu, B.G. Sammakia, and M. Poliks, “Resistance Change Modeling of Sputtered Thin Films on Flexible Substrates under Fatigue Test”, Institute of Industrial Engineers Annual Conference, May 2010, http://www.iienet2.org/annual2/details.aspx?id=10042 . 109. Zhou, S., and B.G., Sammakia, “Modeling Of Two-Phase Micro-Channel Flow For Thermal Management Of Electronic Systems”, Proceedings of the ASME 2010 International Mechanical Engineering Congress & Exposition, IMECE2010, November 12-18, 2010, Vancouver, British Columbia, Canada, IMECE2010-37219. 110. Dan, B., J.F. Geer, and B.G. Sammakia, “Heat Conduction In A Rectangular Tube With Eccentric Hot Spots”, Proceedings of the ASME 2010 International Mechanical Engineering Congress & Exposition, IMECE2010, November 12-18, 2010, Vancouver, British Columbia, Canada, IMECE2010-37554. 111. Raghu, A., S. Karajgikar, D.Agonafer, B.G. Sammakia and G.R. Ahmed, “Thermal-Aware Power Migration In Many-Core Processors”, Proceedings of the ASME 2010 International Mechanical Engineering Congress & Exposition, IMECE2010, November 12-18, 2010, Vancouver, British Columbia, Canada, IMECE2010-40232. 112. Ibrahim, M., S.Bhopte, B.G. Sammakia, B.Murray, M. Iyengar and R. Schmidt, “Effect Of Thermal Characteristics Of Electronic Enclosures On Dynamic Data Center Performance”, Proceedings of the ASME 2010 International Mechanical Engineering Congress & Exposition, IMECE2010, November 12-18, 2010, Vancouver, British Columbia, Canada, IMECE2010-40914. 113. Xu, X., B.G. Sammakia, D.Y. Jung, and T. Eilertsen, “Multiphysics Approach To Modeling Supercapacitors For Improving Performance”, Proceedings of the ASME 2011 Pacific Rim Technical Conference & Exposition on Packaging and Integration of Electronic and Photonic Systems InterPACK2011 July 6-8, 2011, Portland, Oregon, USA. IPACK2011-52081. 114. Chakravorty, S., B.G. Sammakia, and V. Calmidi, “Thermal Characterization Of Non-Isolated Dc To Dc Convertor”, Proceedings of the ASME 2011 Pacific Rim Technical Conference & Exposition on Packaging and Integration of Electronic and Photonic Systems InterPACK2011 July 6-8, 2011, Portland, Oregon, USA. IPACK2011­ 115. Chauhan, A., B.G. Sammakia, K. Ghose, G.R. Ahmed, and D. Agonafer, “Single-Phase Microchannel Cooling For Stacked Single Core Chip And Dram”, Proceedings of the ASME 2011 Pacific Rim Technical Conference & Exposition on Packaging and Integration of Electronic and Photonic Systems InterPACK2011 July 6-8, 2011, Portland, Oregon, USA. IPACK2011-52137 116. Chauhan, C., B.G. Sammakia, F. Afram, K. Ghose, G.R.. Ahmed, and D. Agonafer, “Single-Phase Liquid Cooling Of A Quad-Core Processor”, Proceedings of the ASME 2011 Pacific Rim Technical Conference & Exposition on Packaging and Integration of Electronic and Photonic Systems InterPACK2011 July 6-8, 2011, Portland, Oregon, USA. IPACK2011-52139 117. Ibrahim, M., F. Afram, B.G. Sammakia, K. Ghose, B. Murray, M. Iyengar, and R. Schmidt, “Characterization Of A Server Thermal Mass Using Experimental Measurements”, Proceedings of the ASME 2011 Pacific Rim Technical Conference & Exposition on Packaging and Integration of Electronic and Photonic Systems InterPACK2011 July 6-8, 2011, Portland, Oregon, USA. IPACK2011-52165 118. Ibrahim, M., F. Afram, K. Ghose, B.G. Sammakia, S. Bhopte, B. Murray, M. Iyengar, and R. Schmidt, “Numerical Study On The Reduction Of Recirculation Using Sealed Cold Aisles And Its Effects On The Efficiency Of The Cooling Infrastructure”, Proceedings of the ASME 2011 Pacific Rim Technical Conference & Exposition on Packaging and Integration of Electronic and Photonic Systems InterPACK2011 July 6-8, 2011, Portland, Oregon, USA. IPACK2011-52166 119. Song, Z., B. Murray, and B.G. Sammakia, “Multivariate Prediction Of Airflow And Temperature Distributions Using Artificial Neural Networks”, Proceedings of the ASME 2011 Pacific Rim Technical Conference & Exposition on Packaging and Integration of Electronic and Photonic Systems InterPACK2011 July 6-8, 2011, Portland, Oregon, USA. IPACK2011-52167 120. Tambat, A., H.Y. Lin, I. Claydon, G. Subbarayan, D.Y. Jung and B.G. Sammakia, “Modeling Fracture in Dielectric Stacks due to Chip-Package Interaction: Impact of Dielectric Material Selection”, Proceedings of the ASME 2011 Pacific Rim Technical Conference & Exposition on Packaging and Integration of Electronic and Photonic Systems InterPACK2011 July 6-8, 2011, Portland, Oregon, USA. IPACK2011-52237 52121 121. Tambat, A., H.Y. Lin, I. Claydon, G. Subbarayan, D.Y. Jung and B.G. Sammakia, “Nature of Package-Induced Deformation and the Risk of Fracture in Low-k Dielectric Stacks”, Proceedings of the ASME 2011 Pacific Rim Technical Conference & Exposition on Packaging and Integration of Electronic and Photonic Systems InterPACK2011 July 6-8, 2011, Portland, Oregon, USA. IPACK2011-52258 122. Chen, C., E. Samadiani and B.G. Sammakia “Compact Modeling Of Fractal Tree- Shaped Microchannel Liquid Cooling System” Proceedings of the ASME 2011 International Mechanical Engineering Congress & Exposition, IMECE2011, November 11-17, 2011, Denver, Colorado, US [IMECE2011-65220] 123. Chauhan, A., B.G. Sammakia, F. Afram, K. Ghose, G. Refai-Ahmed and D. Agonafer “Liquid Cooling Of A Stacked Quad-Core Processor And Dram Using Laminar Flow In Microchannel” Proceedings of the ASME 2011 International Mechanical Engineering Congress & Exposition, IMECE2011, November 11-17, 2011, Denver, Colorado, US [IMECE2011-65866] 124.Xu, X., B. G. Sammakia, B. Murray, D.Y Jung, and T.Eilerston, “ Thermal Modeling And Heat Management Of Supercapacitor Modules By High Velocity Impinging Fan Flow” Proceedings of the ASME 2011 International Mechanical Engineering Congress & Exposition, IMECE2011, November 11-17, 2011, Denver, Colorado, US [IMECE2011-65676] 125. Alzoubi, K., M.M. Hamasha, M. Schadt, S Lu, B.G. Sammakia, and M. Poliks, “Effect Of Lamination On The Bending Fatigue Life Of Copper Coated PET Substrate” Proceedings of SPIE 7956, 79560X, 2011. 126. Ibrahim, M., S. Shrivastava, B.G. Sammakia, and K. Ghose, “Thermal Mass Characterization Of A Server At Different Fan Speeds”, Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012. 127. Song, Z., B. Murray, B.G. Sammakia, and S. Lu, “Multi-Objective Optimization Of Temperature Distributions Using Artificial Neural Networks”, Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012. 128. Chauhan, A., B.G. Sammakia, F. Afram, K. Ghose, G. Refai-Ahmed, and D. Agonafer, “Analysing Real Time Power Of The Microprocessor To Estimate Thermal Time Constant Of The Hotspot”, Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012. 129. Dan, B., B.G. Sammakia, S. Kanuparthi, G. Subbarayan, and S. Mallampati, “The Study Of The Polydispersivity Effect On The Thermal Conductivity Of Particulate Thermal Interface Materials To Refine The Random Network Model”, Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012. 130. Xu, X., M.M. Meyers, B.G. Sammakia, and B. Murray, “Thermal Modeling Of Hybrid Concentrating PV/T Collectors With Tree-Shaped Channel Networks Cooling System”, Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012. 131. Zhou, S., B.G. Sammakia, B. White, and P. Borgesen, “A Multiscale Modeling Of Thermoelectric Generators For Conversion Efficiency Optimization”, Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012. 132. Sami Alkharabsheh and B. Sammakia, "Utilizing practical fan curves in CFD modeling of a data center" Semiconductor, Thermal Measurement and Management Symposium (SEMI-THERM), 2013 29th Annual IEEE 133. Zhihang Song, Bruce T. Murray and Bahgat Sammakia, “IMPROVED ZONAL MODEL FOR DATA CENTER ANALYSIS”, Proceedings of the ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK2013 July 16-18, 2013, Burlingame, CA, USA IPACK2013-73048 134. Zhihang Song, Bruce T. Murray and Bahgat Sammakia, “PREDICTION OF HOT AISLE PARTITION AIRFLOW BOUNDARY CONDITIONS”, Proceedings of the ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK2013 July 16-18, 2013, Burlingame, CA, USA IPACK2013-73049 135. Tianyi Gao, Emad Samadiani, Bahgat Sammakia, and Roger Schmidt “COMPARATIVE THERMAL AND ENERGY ANALYSIS OF A HYBRID COOLING DATA CENTER WITH REAR DOOR HEAT EXCHANGERS”, Proceedings of the ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK2013 July 16-18, 2013, Burlingame, CA, USA IPACK2013-73101 136. Cheng Chen, Emad Samadiani, Bahgat Sammakia, “COMPARATIVE NUMERICAL ANALYSIS OF ANGLED BRANCHING MICROCHANNEL HEAT SINK “ Proceedings of the ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK2013 July 16-18, 2013, Burlingame, CA, USA IPACK2013-73141 137. Hung-Yun Lin, Kritika Upreti, Allen Tippmann, Ganesh Subbarayan, Dae Young Jung and Bahgat Sammakia, , “SIMULATIONS OF DEFORMATION AND STRESS DURING COPPER WIREBOND ON ULK CHIPS “ Proceedings of the ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK2013 July 16-18, 2013, Burlingame, CA, USA IPACK2013-73178 138. Tianyi Gao, Emad Samadiani, Roger Schmidt and Bahgat Sammakia, “Dynamic analysis of hybrid cooling data centers subject to the failure of CRAC units “ proceedings of the ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK2013 July 16-18, 2013, Burlingame, CA, USA IPACK2013-73196 139. Sami A. Alkharabsheh, Bahgat Sammakia, Saurabh Shrivastava, Michael Ellsworth, Milnes David, and Roger Schmidt and “A numerical steady and dynamic study in a data center using calibrated fan curves for CRACS and servers “ proceedings of the ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems InterPACK2013 July 16-18, 2013, Burlingame, CA, USA IPACK2013-73217 140. Sai Sudharsanan Paranjothy; Singh, Yuvraj; Tippman, Allen; Hung-Yun Lin; Subbarayan, Ganesh; Dae Young Jung; Sammakia, Bahgat, "Characterization of cu free air ball constitutive behavior using microscale compression test," Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on , vol., no., pp.365,368, 27-30 May 2014 URL: http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6892303&isnumber=68 92251 141. Alkharabsheh, Sami; Sammakia, Bahgat; Murray, Bruce; Shrivastava, Saurabh; Schmidt, Roger, "Experimental characterization of pressure drop in a server rack," Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on , vol., no., pp.547,556, 27-30 May 2014 doi: 10.1109/ITHERM.2014.6892329 URL: http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6892329&isn umber=6892251 142. Upreti, Kritika; Hung-Yun Lin; Subbarayan, Ganesh; Jung, Dae Young; Sammakia, Bahgat, "Simulations of damage and fracture in ULK under pad structures during Cu wirebond process," Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on , vol., no., pp.609,615, 27-30 May 2014 doi: 10.1109/ITHERM.2014.6892337 URL: http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6892337&isn umber=6892251 143. Gao, Tianyi; Sammakia, Bahgat; Geer, James; Ortega, Alfonso; Schmidt, Roger, "Transient effectiveness characteristics of cross flow heat exchangers in data center cooling systems," Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on , vol., no., pp.688,697, 27-30 May 2014 URL: http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6892348&isn umber=6892251 144. Nemati, Kourosh; Murray, Bruce T.; Sammakia, Bahgat, "Experimental characterization and modeling of a water-cooled server cabinet," Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on , vol., no., pp.723,728, 27-30 May 2014 URL: http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6892352&isn umber=6892251 145. Song, Zhihang; Murray, Bruce T.; Sammakia, Bahgat, "Parametric analysis for thermal characterization of leakage flow in data centers," Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on , vol., no., pp.778,785, 27-30 May 2014 URL: http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6892360&isn umber=6892251 146. Alkharabsheh, Sami; Sammakia, Bahgat; Shrivastava, Saurabh; Schmidt, Roger, "Dynamic models for server rack and CRAH in a room level CFD model of a data center," Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Conference on , vol., no., pp.1338,1345, 27-30 May 2014 URL: http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6892435&isn umber=6892251 147. Gao, T., Geer, J., Tipton, R., Murray, B., Sammakia, B. G., Ortega, A., & Schmidt, R. (2015, July). Raised Floor Hybrid Cooled Data Center: Effect on Rack Inlet Air Temperatures When In Row Cooling Units are Installed Between the Racks. In ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels (pp. V001T09A012-V001T09A012). American Society of Mechanical Engineers. 148. Poliks, B., Chen, C., White, B. E., & Sammakia, B. (2015, May). Molecular Dynamics simulations of thermal conductivity in composites consisting of aluminum oxide nanoparticles surrounded by polyethylene oxide. InElectronic Components and Technology Conference (ECTC), 2015 IEEE 65th (pp. 1920-1925). IEEE. 149. Gao, T., David, M., Geer, J., Schmidt, R., & Sammakia, B. (2015, March). A dynamic model of failure scenarios of the dry cooler in a liquid cooled chiller-less data center. In Thermal Measurement, Modeling & Management Symposium (SEMI­THERM), 2015 31st (pp. 113-119). IEEE. 150. Kansara, N., Katti, R., Nemati, K., Bowling, A. P., & Sammakia, B. (2015, July). Neural Network Modeling in Model-Based Control of a Data Center. InASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels (pp. V001T09A034-V001T09A034). American Society of Mechanical Engineers. 151. Alissa, H. A., Nemati, K., Sammakia, B., Seymour, M., Schneebeli, K., & Schmidt, R. (2015, July). Experimental and numerical characterization of a raised floor data center using rapid operational flow curves model. In ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels (pp. V001T09A016­V001T09A016). American Society of Mechanical Engineers. 152. Gao, T., Sammakia, B. G., Geer, J., Murray, B., Tipton, R., & Schmidt, R. (2015, July). Comparative Analysis of Different In Row Cooler Management Configurations in a Hybrid Cooling Data Center. In ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels(pp. V001T09A011-V001T09A011). American Society of Mechanical Engineers. 153. Alissa, H. A., Nemati, K., Sammakia, B., Ortega, A., King, D., Seymour, M., & Tipton, R. (2015, July). Steady state and transient comparison of perimeter and row-based cooling employing controlled cooling curves. InASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels (pp. V001T09A017­V001T09A017). American Society of Mechanical Engineers. 154. Gao, T., del Valle, M., Ortega, A., & Sammakia, B. G. (2015, July). Numerical and Experimental Characterization of the Transient Effectiveness of a Water to Air Heat Exchanger for Data Center Cooling Systems. InASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels (pp. V001T09A043-V001T09A043). American Society of Mechanical Engineers. 155. Nemati, K., Gao, T., Murray, B. T., & Sammakia, B. (2015, March). Experimental characterization of the rear door fans and heat exchanger of a fully-enclosed, hybrid-cooled server cabinet. In Thermal Measurement, Modeling & Management Symposium (SEMI-THERM), 2015 31st (pp. 155-162). IEEE. 156. Alissa, H. A., Nemati, K., Sammakia, B., Ghose, K., Seymour, M., & Schmidt, R. (2015, March). Innovative approaches of experimentally guided CFD modeling for data centers. In Thermal Measurement, Modeling & Management Symposium (SEMI­THERM), 2015 31st (pp. 176-184). IEEE. 157. Nemati, K., Alissa, H. A., Murray, B. T., Sammakia, B., & Seymour, M. (2015, July). Experimentally validated numerical model of a fully-enclosed hybrid cooled server cabinet. In ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels (pp. V001T09A041-V001T09A041). American Society of Mechanical Engineers. 158. Chauhan, A., Sammakia, B., & Ghose, K. (2015, March). Transient power analysis to estimate the thermal time lag of a microprocessor hot spot. InThermal Measurement, Modeling & Management Symposium (SEMI-THERM), 2015 31st (pp. 75-81). IEEE. 159. Paranjothy, S. S., Subbarayan, G., Jung, D. Y., & Sammakia, B. G. (2015, July). An Inverse Procedure for Estimating the Anand Viscoplastic Constitutive Model Parameters for Copper Free-Air Ball. In ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels (pp. V002T01A009-V002T01A009). American Society of Mechanical Engineers. Trade Journals: 1. “Flip-Chip Technology in Organic Chip Carriers,” Bahgat Sammakia, Frank Andros and Ronald Gedney, Circuits Assembly, February 1999, pages: 31-40. 2. “Small (Scale) Research, Big Impact,” Electronic News online, January 21, 2002. Patents: 1. Funari, J., M. Green, S. Reynolds, and B. Sammakia. Electronic Package With Improved Heat Sink. July 1989, US Patent #4,849,856. 2. Anschel, M., and B. Sammakia. Electronic Package With Heat Spreader Member. April 1990. US Patent #4,914,551. 3. Baker, D., J. Funari, W. Otto, B. Sammakia, and R. Stutzman. Electronic Assembly With Enhanced Heat Sinking. March 1991. US Patent #5,003,429. 4. Ameen, J., J. Funari, B. Sammakia, D. Sissenstein, Jr., and S. Smey. Epoxy Composition and Use Thereof. July 1991, US Patent #5,028,984. 5. Funari, J., T. Godown, S. Reynolds, and B. Sammakia. Pluggable Electronic Circuit Package Assembly With Snap Together Heat Sink Housing. April 1992. US Patent #5,109,318. 6. Anschel, M., A. Ingraham, C. Lamb, M. Lowell, V. Markovich, W. Mayr, R. Murphy, M. Pierson, T. Powers, T. Reny, S. Reynolds, B. Sammakia, and W. Storr, Method And Apparatus For Testing Of Integrated Circuit Chips. May 1995, US Patent. #5,420,520. 7. Mok, L., S. Purushothaman., B.Sammakia., J. Wilczynski., and T. Wu. Electronic Package Having Active Means To Maintain Its Operating Temperature Constant. February 1996, US Patent #5,491,610. 8. Kosteva, S. and B.Sammakia., Assembly Mounting Techniques For Heat Sinks In Electronic Packaging. February 1999, US Patent #5,870,285. 9. Sammakia, B. and S. Sathe., Electronic Packages and Method to Enhance the Passive Thermal Management of Electronic Packages. June 1999, US Patent #5,912,800. 10. Sammakia, B., and S. Sathe., Electronic Packages and a Method to Improve Thermal Performance of Electronic Packages. October 1999, US Patent #5,966,290. 11. Sammakia, B. and S. Sathe. Electronic Packages and a Method to Improve Thermal Performance of Electronic Packages. May 2000, US Patent #6,058,015. 12. Sammakia, B., and S.Sathe. Method for using Pulsating Flow to Improve Thermal Transport in Systems. April 2001, US Patent #6,219,234. 13. Cho, J., S. Oliver, W. Jones, and B. Sammakia, Surface Coating for Electronic Systems, October 2007, US Patent #7,282,254,B1. 14. Sammakia, B., W. Jones, and G. Subbarayan, Nano-Structure Enhancements for Anisotropic Conductive Adhesive And Thermal Interposers, January 2010, US Patent #7,645,512. 15. Sammakia, B., H. Wang, Y. Liu, and K. Yang, Nanomaterials Construction of Thermal Interface Materials, March 2012, US Patent #8,129,001. 16. Sammakia, B., J. Cho, W. Jones, and S. Oliver, Method of Manufacturing Surface Coatings for Electronic Systems, April 2012, US Patent #8,158, 201. 17. Sammakia, B., W. Jones, and G. Subbarayan, Nano-Structure Enhancements for Anisotropic Conductive Adhesive and Thermal Interposers, May 2012, US Patent #8,173,260. 18. Sammakia, B., W. Jones, and G. Subbarayan, Nano-Structure Enhancements for Anisotropic Conductive Adhesive and Thermal Interposers, August 27, 2013, US Patent # 8,518,304 19. Sammakia, B., Method and Pattern of Dispensing Thermal Interface Materials, July 2013, US Patent #8,481,103. 20. Cho, J., S. Oliver, W. Jones, and B. Sammakia, Surface Coating for Electronic Systems, April 1, 2014, US Patent # 8,685,529. 21. Cho; Junghyun, Sammakia; Bahgat, Poliks; Mark D., Magnuson; Roy; Biplab Kumar, Embedded thin films, November 11 2014, US Patent # 8,882,983 22. Wang; Hao, Sammakia; Bahgat, Liu; Yayong, Yang; Kaikun, Composite thermal interface material system and method using nano-scale components, April 29 2015, US Patent # 9,017,808 IBM Published Invention Disclosures: 1. “A transient test of the temperature coefficient of resistance for CERMET resistors,” EN885-0182, 1988. 2. “Substrate temperature measurement using integral surface resistors,” EN885-0158, 1988. 3. “Flexible heat sink,” EN887-0171, 1988. 4. “Thermally enhanced surface mount modular tape automated bonding package,” EN887­0255, 1989 5. “Lead planarity compensator for inner lead bonders,” EN887-0551, 1990. 6. “Alignment technique by Cu etching for solder attaching chips to TAB,” EN887-0502, 1991. 7. “Improved high density area array contact design,” EN893-0269, 1994. 8. “Impingement heat sink,” AT893-1081, 1994. 9. “Densely populated, vertically stacked multi chip module,” EN893-0062, 1995. 10. “High conductivityfibrous heat sink,” AT894-0320, 1995. Graduated Advisees: PhD: 1. “Thermal Management of Small Scale Electronic Systems,” Anand Desai, PhD Dissertation, Mechanical Engineering, 2006. 2. “Die stress analysis in plastic encapsulated electronic packages-an experimental and numerical approach” Satish Chaparala, PhD Dissertation, Mechanical Engineering, 2006. 3. “Coolinganalysis ofdatacenters:CFD modelingand real timecalculators”,SaurabhK. Shrivastava, PhD Dissertation, Mechanical Engineering, 2008. 4. Assembly process development, reliability and numerical assessment of copper column flexible flip chip technology”, TA-Hsuan Lin, PhD in Systems Science and Industrial Engineering, 2008. (Co advisor with Professor Susan Lu (SSIE Department)) 5. “Study of Transport Processes from Macroscale to Microscale”, Siddharth Bhopte, PhD Mechanical Engineering, August 2009. 6. “Applications of Microfluidics : Electronics Cooling and Prevention of Infection”, Dylan Farnam, PhD Dissertation Mechanical Engineering, May 2010 7. “Research Into the Process, Materials and Tool Interaction For Large Area Flexible Electronics With Micron Sized Features”, Hao Zhang, PhD Dissertation, Mechanical Engineering, May 2010. 8. “Experimental and Analytical Studies of the High Cyclic Bending Fatigue of Thin Films on Flexible Substrates foe Flexible Electronics Applications”, Khalid Alzoubi, PhD in Systems Science and Industrial Engineering, December 2010. (Co advisor with Professor Susan Lu (SSIE Department)). 9. “A Systems Based Approach to Reliability Assessment of Lead Free Soldered Electronic Packages Under ThermalCyclingLoading”, Emad Shehadeh Al-Momani, PhD in Systems Science and Industrial Engineering, December 2010. (Co advisor with Professor Mohammad Khasawneh (SSIE Department)). 10. “A study of Selected Failure Mechanisms in a Non-Hermetic Optoelectronic Module”, Sushma Madduri, PhD Dissertation, Mechanical Engineering, 2011. 11. “Dynamic Thermal Management Of Data Centers”, Mahmoud Ibrahim, PhD Dissertation, Mechanical Engineering, 2012. 12. Analytical and experimental studies to determine the effective thermal conductivity of particulate thermal interface materials. Dan, Bo, PhD Mechanical Engineering, STATE UNIVERSITY OF NEW YORK AT BINGHAMTON, 2012. 13. “ Multi scale thermal transport in electronics”. Lakshmi Pisipati, PhD Mechanical Engineering, STATE UNIVERSITY OF NEW YORK AT BINGHAMTON, 2013. 14. Xu, Xinqiang. "An analytical and numerical study of emerging energy-storage/energy­conversion devices to improve their overall performance." PhD diss., STATE UNIVERSITY OF NEW YORK AT BINGHAMTON, 2013. 15. "Study of the growth conditions of carbon nanomaterials and their application to energy storage devices." Gao, Yang. PhD diss., STATE UNIVERSITY OF NEW YORK AT BINGHAMTON, 2013. 16. "Numerical modeling on biofilm deformation and removal under jet impingement and electrochemical measurements monitoring biofilm development using flexible sensors." Zheng, Leo Young. PhD diss., STATE UNIVERSITY OF NEW YORK AT BINGHAMTON, 2013. 17. “Multiscale modeling of electronics cooling and energy conversion devices“, Siyi Zhou, PhD diss., STATE UNIVERSITY OF NEW YORK AT BINGHAMTON, 2014. 18. "Static and dynamic thermal management of high performance microprocessors." Chauhan, Anjali. PhD diss., STATE UNIVERSITY OF NEW YORK AT BINGHAMTON, 2014. 19. "Numerical investigation on the thermal issues of micro-scale electronic devices and optimization of heat dissipating solutions." Chen, Cheng. PhD diss., STATE UNIVERSITY OF NEW YORK AT BINGHAMTON, 2015. 20. EXPERIMENTAL AND ANALYTICAL STUDIES OF DATA CENTER THERMAL MANAGEMENT UNDER DYNAMIC CONDITIONS, Sami Alkharabsheh, PhD diss., STATE UNIVERSITY OF NEW YORK AT BINGHAMTON, 2015. Master’s (MS) 1. “Computational Parameter Study of Chip Scale Package Array Cooling,” Sean Watson, MS, Mechanical Engineering, 2000. 2. “Numerical Analysis Of A Tape Ball Grid Array (Tbga) Package,” Satish Gutikonda, MS, Mechanical Engineering, 2001. 3. “Selection of Fatigue Life Prediction under Random Loading,” Amit Awasthi, MS, Mechanical Engineering, 2001. 4. “Towards The Optimization of Air Cooled Heat Sinks For Microprocessors,” Amit Shah, MS, Industrial Engineering, 2002. 5. “Modeling and Reliability Analysis Of Wafer-Level Chip Scale Packaging,” Satish Chaparala, MS, Mechanical Engineering, 2002. 6. “Study of Assembly Processes For Liquid Crystal On Silicon (LCoS) Microdisplays,” Anupam Choubey, MS, Mechanical Engineering, 2003. 7. “Selection Of Method For Fatigue Life Prediction Under Random Loading,” Amit Awasthi, MS, Mechanical Engineering, 2003. 8. “Thin Film Measurement and Outgassing Study of Adhesives used in Optical MEMS Devices,” Vijay Sundermurthy, MS, Mechanical Engineering, 2003. 9. “Numerical Modeling of Underfill Flow Process,” Yang Jiang, MS, Mechanical Engineering, 2003. 10. “A Study of Nanostructure Enhanced Thermal Interface Material,” Anand H. Desai, MS, Mechanical Engineering, 2003. 11. “Mechanical Modeling of Liquid Crystal on Silicon (LCoS) Microdisplay,” Gayatri Cuddalorepatta, MS, Mechanical Engineering, 2003. 12. “Thermal Management Of Biomaterials In a Rectangular Cavity Surrounded By A Phase Change Material,” Saurabh Shrivastava, MS, Mechanical Engineering, 2004. 13. “Experimental Measurement of Bond Line Thermal Resistance for a Commercial Thermal Interface Material,” Suresh Vaddigiri, MS, Mechanical Engineering, 2004 14. “Thermomechanical Issues of A Ball Light Collimator In Liquid Crystal Displays,” Satej Bidwe, MS, Mechanical Engineering, 2005. 15. “A Study Of Nanostructure Enhanced Thermal Interface Material,” Anand Desai, MS, Mechanical Engineering, 2006. 16. “Thermal Analysis of Mems Actuator Performance”, Harita Machiraju, MS, Mechanical Engineering, 2006. 17. “Development and Verification of An Apparatus For Thermal Resistance And Thermal Conductivity Measurements,” Kaustubh Kalkundri, MS, Mechanical Engineering, 2006. 18. “Comparative Analysis of Microchannel Heat Sink Configurations Subject To A Pressure Constraint,” Dylan Farnam, MS, Mechanical Engineering, 2007. 19. “Design and Modeling of High-DensityFilm Based Microinterconnects,” Fan Zhou, MS, Mechanical Engineering, 2008. 20. “Mitigation of Hot Spots In Microprocessors By Application Of Microchannel Heat Sinks And Microprocessor Floor Planning”, Anjali Chauhan MS, Mechanical Engineering, 2009. 21. “Board Level Energy Comparison and Interconnect Reliability Modeling Under Drop Impact,” Akash Agrawal, MS, Mechanical Engineering, 2009. 22. “Improving The Thermal Performance Of An Impingement Heat Sink By Modifying The Fin Shapes”, Sravan Kumar Gondipalli, MS, Systems Science and Industrial Engineering, December 2010. 23. “Numerical Modeling Of Data Center Clusters To Optimize Thermal Management”, Srujan Kumar Gondipalli, MS, Systems Science and Industrial Engineering, December 2010. 24. “Analytical Study Of Web Inspection System Experimental Variables Using Reflective Substrate”, Bhawana Bhopte, MS, Systems Science and Industrial Engineering, December 2010. 25. “Optimization Study of Supercapacitor Electrode Material And Thickness For Its Enhanced Performance”, Ajinkya P. Ranade, MS, Mechanical Engineering, 2011. 26. “Interfacial Adhesion Measurements of Low-K and Ultra-Low K Dielectric Thin Films”, Ian Claydon, MS, Mechanical Engineering, 2011. 27. “Impingement Heat Sink Optimization And Thermal Characterization Of A Power Module Using Commercially Available Cfd Code”, Shiladitya Chakravorty, MS, Industrial and Systems Science Engineering, 2011. 28. “A Representative Finite Element Model For Determining The Effective Thermal Conductivity Of Particulate Thermal Interface Materials”, Sandeep Mallampati, MS, Mechanical Engineering, 2011. 29. Performance and Assembly Of Silver Nanoparticle Based Thermal Interface Materials For Electronic Systems”, Evan Chenelly, MS, Mechanical Engineering, 2012. TEACHING/CIRRICULUM DEVELOPMENT: . “Fundamentals of Electronics Packaging”” Watson 582, was developed in 1999. The course was offered again in 2000. Student registration in the course increased from 36 in 1999 to 52 in 2000. The student breakdown was 47 graduates and 5 undergraduates. Fourteen of the students were on Enginet, and several of them were at different industrial settings around the country. The course was presented by six faculty members from the Watson School, Chemistry and Physics. This course continues into 2005. . Organized and managed the senior design class for the department of mechanical engineering. Twelve projects from industry were split amongst the students in typical teams of 3-5 students. Many of the projects were electronics-packaging related and two of them were in the area of biomedical devices. PROFESSIONAL COURSES: . “Electrical and Thermal Co-Design of Microprocessors; Towards an Optimized Design”, Co-taught this 4 hour professional class with Professor Kanad Ghose, Prof Dereje Agonafer and Dr. Gamal Refai-Ahmed, 12th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2010), Las Vegas Nevada, June 2-5 2010. . “Identifying the Challenges in the Next Generation of Microprocessors-Parts I and II, Gamal, Refai-Ahmed, Dereje Agonafer and Bahgat Sammakia, held at Interpack 2009, San Francisco, CA, July 2009. . “Thermal Design of Electronic Equipment: From Portables to Mainframes,” B. Sammakia, Y. Joshi, S. Sathe and D. Agonafer, taught at: Semi-Therm Conference, San Jose CA, February 1995 . Itherm Conference Seattle, WA, June 1998, 2000, 02, 06, 08 . InterPack Conference 1997, 99, 01,03, 07 Current students advised: PhD: 1. Ian Claydon PhD student ME graduation expected 2015 2. Tianyi Gao PhD student ME graduation expected 2015 3. Husam A. Alissa PhD student ME graduation expected 2016 4. Bharath Ramakrishnan PhD student ME graduation expected 2017 5. Steve Gonya PhD student ME (Part time student, LM Owego) Post-Doctoral Fellows: . Drew Davidson. Mechanical Engineering, 2008-2010 . Siddharth Bhopte Mechanical Engineering, 2009-2010 . Hao Zhang, 2009-2010 . Sami Alkharabsheh 2015-current Visiting Research Professors: . Emad Samadiani, 2009-2011 Thesis Committees Served: 1. “Computational Parameter Study of Chip Scale Package Array Cooling,” Masters Thesis, Mechanical Engineering Dept., S.P. Watson, 2000. 2. “A Systems Based Predictive Approach For Optimizing The Lead Free Flip Chip Assembly Process,” PhD, Industrial Engineering, Sandeep Tonapi, 2000. 3. “A Technique for Modeling the Warpage of an Area Array Component,” Masters Thesis, Mechanical Engineering, R.H. Fenton, 2000. 4. “Thermal Fatigue Life Prediction of Ceramic Ball Grid Array Assemblies,” Masters Thesis, Mechanical Engineering, M. Nagarajan, 2000 5. “Identification of Error Sources in Mechanical Measurements of Electronic Packages using Moiré Interferometry,” Masters Thesis, Mechanical Engineering, J.R. Rayner, 2000. 6. “Modeling and ReliabilityAnalysis of Chip Scale Packages,” Masters Thesis, Mechanical Engineering, S. Sethuraman, 2000. 7. “Optical Measurement of Electronic Packages: Improvements to Existing Techniques,” MS, Mechanical Engineering, M. Seus, 2000. 8. “Electrical Characteristics of an ACF Board,” MS, Electrical Engineering, J. Weidler, 2000. 9. “Kinetics, Mechanism and Detection of the Reactive Intermediates of Dimethylamine Borane in Electroless Gold Baths,” Ph.D. Dissertation, Chemistry, A. Sargent, 2000. 10. “ReliabilityImprovement of Area Array Solder Joints: Changing Attachment Pad Geometry,” PhD, Mechanical Engineering, A. Primavera, 2000. 11. “Computational Parameter Study of Chip Scale Package Array Cooling,” MS, Mechanical Engineering, S.P. Watson, 2000. 12. “Simulation of Slip Defect Generation on Gallium Arsenide Wafers during a Molecular Beam Epitaxy Process using Finite Element Method,” MS, Industrial Engineering, Vainateya, 2000. 13. “Thermal Performance of Liquid Solder Joint between Metal Faces,” MS, Mechanical Engineering, D.A. Davidson, 2001. 14. “Thermal Analysis of a Commercially Available Underfill and Several Sn-based Solder Intermetallics,” BS Research Thesis, Mechanical Engineering, Susan Pitely, 2001. 15. “Characterization of ACF Used as A Flex to Card Interconnect,” Ananth Prabhakumar, MS, Electrical Engineering, 2001. 16. “Reliability testing of electrically conductive adhesives,” Santosh Anil Kudtarki, MS, Electrical Engineering, December, 2001. 17. “Thermal Mechanical Testing of NiTi Memory Alloy,” Thirumalesh Bannuru, MS, Mechanical Engineering, December, 2001. 18. “Yield Modeling and Optimization for an EMS Provider using a Hybrid System of Neural Networks and Genetic Algorithms,” Swaminathan Vaithianathasamy, MS Industrial Engineering, 2002. 19. “Assembly of Copper Column Interconnect Flip Chip Technology,” Sihong Ma, MS, Industrial Engineering, April 2002. 20. “Flip Chip Assembly in Air from Manufacturing and Reliability Perspectives,” Ji Hyon Mun, PhD, Industrial Engineering, April 2003. 21. “Experimental Investigation of Enclosure Geometry on Cooling Performance of an Embedded Fin Heat Sink,“ Jason Markell, MS Mechanical Engineering, 3-2003. 22. “Numerical Modeling of Underfill Flow Process,” Yang Jiang, MS, Mechanical Engineering, February 2003. 23. “Assembly, Reliability, and Rework of 0.4 mm Pitch Wafer Level Chip Scale Packages (WLCSPs),” PhD, Systems Science, Muffadal Mukadam, July 2004. 24. “A Systems Approach to the Reduction of Thermal Resistance in Microelectronics Packaging,” PhD, Systems Science, Arun Gowda, July 2004. 25. “Underfill Process Development for Lead Free Flip Chip Assembly,” Raghunandan Chaware, PhD, Systems Science, August 2004. 26. “Eliminating Package Resonance Over Wide Frequency Band,” Vijay Madhukar Bapu, MS, August 2004. 27. “Microscopic and Mesoscopic Characteristics of Granular Metal Films,” Fan Wu, PhD, September 2004. 28. “Heat Conduction in Composite Solids using Finite Element Analysis of Unit Cells,” Mukesh Kumar Selvaraj, MS, September 2004. 29. “Impact of Power Cycling on Organic and Ceramic -FC BGA,” Izhar Z. Ahmed, MS, Mechanical Engineering, September 2004. 30. “System in Package: A System Level Investigation for Package Reliability,” Shafi Saiyed, PhD, SSIE, 2004. 31. “System Based Material Design for Wafer Level Underfills,” PhD, SSIE, Ananth Prabhakumar, November 2004. 32. “Thermo-Mechanical Behavior of Tin-Lead and Lead-Free Ceramic Column Grid Array Packages,” M.S., Rahul V. Joshi, January 2005. 33. “Predictive Model for Optimized Design Parameters in Flip-Chip Packages,” MS, Karthik Raghunathan, February 2005. 34. “Explicit Dynamic Analysis of Computer Motherboards,” MS, Priyank Jain, February 2005. 35. “Role of Intermetallics for Both Tin-Lead and Lead Free Solder Structures and Its Solder Pad Combination,” MS, Ganesh Iyer, Mechanical Engineering, 2005. 36. “System-in-Package: A System Level Investigation for Package Reliability,” PhD, Mohammed Shafi Saiyed, Systems Science, 2005. 37. “A Systems Approach to Ultra-Fine Pitch High-Density Flip Chip Interconnect Packaging,” PhD, Kaustubh Ravindra Nagarkar, Systems Science, 2005. 38. “Effect of Bonding Pressure on Joint Reliability in a Chip-on-Flex (COF) Application,” MS, Abilash Puthenparambil, Electrical Engineering, 2006. 39. “Development of Micro-Acoustic Devices with Applications of Viscous Effects,” PhD, Lin Tan, Mechanical Engineering, 2006. 40. “Mechanical Properties of SU-8 and Carbon Nanotubes Reinforced SU-8 from Room Temperature to High Temperatures,” MS, Sandeep Makhar, Mechanical Engineering, 2006. 41. “Fluid Dynamics and Heat Transfer Considerations for Gel Thermal Interface Material (Part 1) and the Underfill Process (Part 2),” PhD, Drew Alan Davidson, Mechanical Engineering, 2006. 42. “Study of Thermal and Chemical Factors which Influence Solidification of Sn in Near Eutectic Sn-3.0Ag-Xcu Lead Free Solder,” MS, Yan Xing, Mechanical Engineering, 2006. 43. “Thermal Management of Small Scale Electronic Systems,” PhD, Anand Desai, Mechanical Engineering, 2006. 44. “Development and Verification of an Apparatus for Thermal Resistance and Thermal Conductivity Measurements,” MS, Kaustubh Kalkundri, Mechanical Engineering, 2006. 45. “Comparative Analysis of Microchannel Heat Sink Configurations Subject to a Pressure Constraint,” MS, Dylan Farnam, 2007. 46. “Experimental Study of Electromigration in Flip Chip Packages,” PhD, Mukesh K. Selvaraj, Industrial Engineering, 2007. 47. “Interfacial Reliability of Pb-Free Flip Chip BGA Package,” PhD, Zhenming Tang, 2008. 48. “Analysis of a Mechanical Hole-Punching Process to Create Registration on a Continuous Roll-to-Roll Flexible Electronics Substrate using SPC Techniques,” MS, Denisse E. Yepez, Industrial Engineering, 2008. 49. “Assembly Process Development Reliability and Numerical Assessment of Copper Column Flexible Flip Chip Technology,” PhD, Ta-Hsuan Lin, 2008. 50. “Deposition of Ceramic Thin Films from Aqueous Solutions at Low Temperatures,” PhD, Guangneng Zhang, 2008. 51. “Investigation of Solder Joint Reliability through Impact Fatigue Loading,” MS, Pradosh Guruprasad, ME, 2008. 52. “Microstructure Based Experimental and Finite Element Analysis of Failure Mechanism of Pb-Free BGA Interconnects,” PhD, Ramji Dhakal, 2008. 53. “A Prototype Multifunction Differential Pressure-Flow Sensor for Medical and Industrial Applications,” MS, Ali Abdul Ali Shakir, Mechanical Engineering, 2008. 54. “Stress Relieving Technique for Plastic Packages in a High Volume Manufacturing Environment,” PhD, Ashish Batra, Industrial Systems Engineering, 2009. 55. “Discrete Particle Swarm Optimization Algorithms for Orienteering and Team Orienteering Problems,” PhD, Shanthi Muthuswamy, Industrial Systems Engineering, 2009. 56. “Indirect Collaborative Evolution for the Facilitation of Group Intelligence in Nursing Care Plan Development,” PhD Dissertation, Daniel Lewis Sloat, SSIE, 2009. 57. “Drop Test Energy Relationship to Reliability,” MS Thesis, TimothyLevo, Mechanical Engineering, 2009. 58. “Using the Forest to See the Trees: Correlation Pattern Recognition and Fractal Context Classification in an Integrated Featureless Computer-Aided Diagnosis System for Non-Palpable Breast Cancer,” PhD Dissertation, SSIE, Elizabeth Verheggen, 2009. 59. “Using the Forest to See the Trees: Correlation Pattern Recognition and Fractal Context Classification in an Integrated Featureless Computer-Aided Diagnosis System for Non-Palpable Breast Cancer,” PhD Dissertation, SSIE, Elizabeth Verheggen, 2009. 60. “Characterization of Thermal Interface Materials using Flash Diffusivity Tester and Infrared Microscopy,” MS Thesis, Viral Chasatia, Mechanical Engineering, 2009. 61. “Investigation of Electromigration Behavior in Lead-Free Flip Chip SolderBumps,” PhD, Kaustubh Kalkundri, Industrial and Systems Engineering, 2010. 62. “Thermal Interface Material Bondless: Particulate Flows in Confined Geometries; Process Dependent Microstructure and Thermal Performance,” David Rae, PhD Materials Science and Engineering, 2012 63. “Characterization of Process and Reliability of Copper Wire Bondingon Aluminum Bond Pads,” Ph.D., Pushkraj Satish Tumne, Industrial and Systems Engineering, 2012. Service to the National and International technical community: . Co-Chair, Awards committee for Interpack 2009, held in San Francisco CA, July 2009. . Co-Chair, Academic Track, United States Displays Consortium Annual Flexible Electronics and Displays Conference and Exhibit, Phoenix, AZ, February 2008. . Chief Editor of the ASME Transactions, Journal of Electronic Packaging-since January 2002. . Technical editor ASME Transactions, Journal of Electronic Packaging, 1989 to 1999. . Associate editor IEEE Transactions on Components and Packaging Technologies, since 2006. . Member ASME K-16 subcommittee on thermal management of electronic equipment since 1985. . IBM STAB member for packaging at the Semiconductor Research Corporation (SRC) 1997/98. Reviewed and evaluated research activities related to packaging at the Univ. of Arizona, Stanford, Cornell, Lehigh, Wayne State University, Univ. of Texas at Austin, and University of Colorado at Boulder. . Served on the science committee for Thermes 2002, a workshop dedicated to future challenges and needs in the thermal management of Electronics, Santa Fe, NM, 1/2002. . Organized and chaired a session on thermal issues in manufacturing of Electronics Packaging, Thermes 2002, Santa Fe, NM, 1/2002. . Chaired and coordinated sessions on thermal management, structural mechanics and reliability in electronic packaging at ASME sponsored conferences, including: o Co-Chair, (with Prof. Ganesh Subbarayan, Purdue University), the Electronics Packaging track at the 2002 ASME IMECE o Track chair for the thermal track at Itherm 2002. Coordinated and organized 22 sessions at the conference all related to thermal management of Electronics Packages and Systems. o Organized and chaired a session on thermal management of electronics at the IMECE 2001, N.Y. o Organized and chaired 1 session at ASME/IMECE1999 o Organized and participated in two panel sessions at the Itherm ‘98 related to coupling effects in organic flip chip packages, and thermal induced phenomena at thermal interfaces. o Organized and chaired two sessions at Itherm 98 o Organized and chaired one session at ASME/IMECE 1998 o Organized two sessions at the Inter-pack meeting in 1995, Maui. o Organized a session at the Fourth Intersociety Conference on Thermal Phenomena in Electronic Systems, Washington, DC, May 4-7 1994. o ASME/JSME International conference on electronic packaging, Milpitas CA, 1993 o Chaired two sessions at the ASME International Packaging Conference, Binghamton, NY 1993. . Newsletter editor for the ASME K-16 subcommittee on thermal management of Electronic Packaging from 85-88. . NEMI member of the modeling and simulation group for 2000, 2002. . NEMI member of the thermal management group for 2000. Recent National Panels and review teams: . Chaired NSF sponsored Panel (with Dr. Roger Schmidt, IBM Fellow), on Dynamic Management of Data Centers’, at the 12th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2010), Las Vegas Nevada, June 2-5 2010. . Chaired NSF Panel (with Professor Avi Bar-Cohen), on Grand Challenges in Thermal Management of Electronics: From Device to Systems, Part II: Green Data Centers, Panel was held at InterPack 2009, San Francisco, CA, July 2009. . Chaired NSF Panel (with Professor Dereje Agonafer and Dr. Gamal Refai-Ahmed), on Grand Challenges in Thermal Management of Electronics: From Device to Systems, Part I: Three Dimensional Chip Stacks with Through Silicon VIAs, Panel was held at InterPack 2009, San Francisco, CA, July 2009. . Member of an NSF review panel for CAREER awards in the area of thermal sciences, November 2008. . Chaired NSF Panel on Grand Challenges in Thermal Management of Electronics: From Device to Systems, ASME IMECE, October 31, 2008, Boston Massachusetts . NSF Workshop on Frontiers in Transport Research and Education. Held at the University of Connecticut in May 2007. Chaired a panel “Panel 2-IT Information Technology”. The panel wrote a report summarizing challenges, barriers and gaps and recommendations for future research. . Member of the NSF review team for the Engineering Research Center (ERC) at Princeton University, Mid-Infrared Technologies for Health and Environment (MIRTHE), 2006, 2007, 2008, 2009, 2010. . Site Visit Reviewer, National Science Foundation, IGERT program 2004, University of Utah, ‘Microscale/Nanoscale thermal fluid systems.’ Undergraduate Research Supervised: . PI and Director National Science Foundation: REU Site: Research Opportunities for Undergraduates in the Field of Electronics Packaging, 01-Jun-2002 to 31-May-2005. . Development of an Internet Based course on Electronics Packaging utilizing a distributed Database, an NSF-funded REU project, 2001/2002. . “High Power Collimated Backlight Cavity with Integrated Lamps and Optics,” Rainbow Displays International, supervised this research effort as a senior design project, 1999­2000. . “Handheld Cryo-Surgical Devices,” Cryo-surgical sciences, a senior design project, 1999-2000. . “A Handheld Device That Is Attached to an Electronic Box (Tethered System),” a senior design project, 1999-2000. . “Fragility of a Back Light Assembly Subjected to Shock and Vibration Input,” a senior design project, 1999-2000. . “Thermocouple Attach Design Methodology,” a senior design project, 1999-2000. . “Design and Build a Precision Manual Polishing Fixture to be Used in the Preparation of IEEC Teardown Electronic Device Micro-Sections,” a senior design project, 1999-2000.